- 您现在的位置：买卖IC网 > PDF目录162995 > 844S012BKI-01LF (INTEGRATED DEVICE TECHNOLOGY INC) OTHER CLOCK GENERATOR, QCC56 PDF资料下载
参数资料
| 型号： | 844S012BKI-01LF |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 时钟产生/分配 |
| 英文描述： | OTHER CLOCK GENERATOR, QCC56 |
| 封装： | 8 X 8 MM, 0.925 MM HEIGHT, ROHS COMPLIANT, MO-220VLLD-2, VFQFN-56 |
| 文件页数： | 5/23页 |
| 文件大小： | 847K |
| 代理商： | 844S012BKI-01LF |
ICS844S012BKI-01 REVISION A APRIL 2, 2010
13
2010 Integrated Device Technology, Inc.
ICS844S012I-01 Data Sheet
CRYSTAL-TO-LVDS/LVCMOS FREQUENCY SYNTHESIZER
Power Supply Filtering Technique
As in any high speed analog circuitry, the power supply pins are
vulnerable to random noise. To achieve optimum jitter performance,
power supply isolation is required. The ICS844S012I-01 provides
separate power supplies to isolate any high switching noise from the
outputs to the internal PLL. VDD, VDDA, VDDOB and VDDO should be
individually connected to the power supply plane through vias, and
0.01F bypass capacitors should be used for each pin. Figure 1
illustrates this for a generic VDD pin and also shows that VDDA
requires that an additional 10
resistor along with a 10F bypass
capacitor be connected to the VDDA pin.
Figure 1. Power Supply Filtering
VFQFN EPAD Thermal Release Path
In order to maximize both the removal of heat from the package and
the electrical performance, a land pattern must be incorporated on
the Printed Circuit Board (PCB) within the footprint of the package
corresponding to the exposed metal pad or exposed heat slug on the
package, as shown in Figure 2. The solderable area on the PCB, as
defined by the solder mask, should be at least the same size/shape
as the exposed pad/slug area on the package to maximize the
thermal/electrical performance. Sufficient clearance should be
designed on the PCB between the outer edges of the land pattern
and the inner edges of pad pattern for the leads to avoid any shorts.
While the land pattern on the PCB provides a means of heat transfer
and electrical grounding from the package to the board through a
solder joint, thermal vias are necessary to effectively conduct from
the surface of the PCB to the ground plane(s). The land pattern must
be connected to ground through these vias. The vias act as “heat
pipes”. The number of vias (i.e. “heat pipes”) are application specific
and dependent upon the package power dissipation as well as
electrical conductivity requirements. Thus, thermal and electrical
analysis and/or testing are recommended to determine the minimum
number needed. Maximum thermal and electrical performance is
achieved when an array of vias is incorporated in the land pattern. It
is recommended to use as many vias connected to ground as
possible. It is also recommended that the via diameter should be 12
to 13mils (0.30 to 0.33mm) with 1oz copper via barrel plating. This is
desirable to avoid any solder wicking inside the via during the
soldering process which may result in voids in solder between the
exposed pad/slug and the thermal land. Precautions should be taken
to eliminate any solder voids between the exposed heat slug and the
land pattern. Note: These recommendations are to be used as a
guideline only. For further information, please refer to the Application
Note on the Surface Mount Assembly of Amkor’s Thermally/
Electrically Enhance Leadframe Base Package, Amkor Technology.
Figure 2. P.C. Assembly for Exposed Pad Thermal Release Path – Side View (drawing not to scale)
VDD
VDDA
3.3V
10
10F
.01F
SOLDER
PIN
EXPOSED HEAT SLUG
PIN PAD
GROUND PLANE
LAND PATTERN
(GROUND PAD)
THERMAL VIA
相关PDF资料 |
PDF描述 |
|---|---|
| 845730021 | INTERCONNECTION DEVICE |
| 845730023 | INTERCONNECTION DEVICE |
| 845730024 | INTERCONNECTION DEVICE |
| 845979013 | INTERCONNECTION DEVICE |
| 845979019 | INTERCONNECTION DEVICE |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 844S0258BK-07LF | 制造商:Integrated Device Technology Inc 功能描述:32 VFQFN (LEAD-FREE) - Bulk |
| 844S0258BK-07LFT | 制造商:Integrated Device Technology Inc 功能描述:32 VFQFN (LEAD-FREE) - Tape and Reel |
| 844S0258CK-07LF | 制造商:IDT from Components Direct 功能描述:IDT 844S0258CK-07LF CLOCKS - TIMERS - Trays 制造商:IDT 功能描述:IDT 844S0258CK-07LF Clocks - Timers |
| 844S2416AKI | 制造商:Integrated Device Technology Inc 功能描述:CLK GEN VFQFN56 - Bulk |
| 844S2416BKI | 制造商:Integrated Device Technology Inc 功能描述:CLK GEN VFQFN56 - Bulk |
发布紧急采购，3分钟左右您将得到回复。