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| 型号： | 85408BGI |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 时钟及定时 |
| 英文描述： | 85408 SERIES, LOW SKEW CLOCK DRIVER, 8 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO24 |
| 封装： | 4.40 X 7.80 MM, 0.925 MM HEIGHT, MO-153, TSSOP-24 |
| 文件页数： | 4/16页 |
| 文件大小： | 755K |
| 代理商： | 85408BGI |
ICS85408I Datasheet
LOW SKEW, 1-TO-8, DIFFERENTIAL-TO-LVDS CLOCK DISTRIBUTION CHIP
ICS85408BGI REVISION B JULY 2, 2009
12
2009 Integrated Device Technology, Inc.
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS85408I.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS85408I is the sum of the core power plus the analog power plus the power dissipated in the load(s). The
following is the power dissipation for VDD = 3.3V + 5% = 3.465V, which gives worst case results.
Power (core)MAX = VDD_MAX * IDD_MAX = 3.465V * 90mA = 311.85mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device. The
maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 70°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.312W * 70°C/W = 106.8°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 6. Thermal Resistance θJA for 24 Lead TSSOP, Forced Convection
θ
JA by Velocity
Meters per Second
01
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
70°C/W
65.0°C/W
62°C/W
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 85408BGILF | 功能描述:时钟缓冲器 Low Skew 1-to-8 Diff to LVDS Clock Dist RoHS:否 制造商:Texas Instruments 输出端数量:5 最大输入频率:40 MHz 传播延迟（最大值）: 电源电压-最大:3.45 V 电源电压-最小:2.375 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LLP-24 封装:Reel |
| 85408BGILF-HT | 制造商:Integrated Device Technology Inc 功能描述:CLOCK BFFR 16-OUT 24TSSOP - Rail/Tube |
| 85408BGILFT | 功能描述:时钟驱动器及分配 Low Skew 1-to-8 Diff to LVDS Clock Dist RoHS:否 制造商:Micrel 乘法/除法因子:1:4 输出类型:Differential 最大输出频率:4.2 GHz 电源电压-最大: 电源电压-最小:5 V 最大工作温度:+ 85 C 封装 / 箱体:SOIC-8 封装:Reel |
| 85408BGIT | 制造商:Integrated Device Technology Inc 功能描述:85408BGIT - Tape and Reel |
| 85408BGLF | 功能描述:时钟缓冲器 Low Skew 1-to-8 Diff to LVDS Clock Dist RoHS:否 制造商:Texas Instruments 输出端数量:5 最大输入频率:40 MHz 传播延迟（最大值）: 电源电压-最大:3.45 V 电源电压-最小:2.375 V 最大功率耗散: 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:LLP-24 封装:Reel |
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