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| 型号： | 87783-0001 |
| 厂商： | Molex Connector Corporation |
| 文件页数： | 3/6页 |
| 文件大小： | 0K |
| 描述： | CONN SOCKET MINIDIMM 22.5DEG SMD |
| 产品目录绘图： | 87783-0001 |
| 标准包装： | 1 |
| 系列： | 87783 |
| 连接器类型： | MiniDIMM |
| 位置数： | 244 |
| 存储器类型： | DDR 2 SDRAM |
| 标准： | MO-244 |
| 安装类型： | 表面贴装，22.5° 角 |
| 特点： | 板导轨，锁存器 |
| 包装： | 托盘 |
| 触点表面涂层： | 金 |
| 触点涂层厚度： | 30µin（0.76µm） |
| 产品目录页面： | 513 (CN2011-ZH PDF) |
| 其它名称： | 087783-0001 087783-0001-E 0877830001 0877830001-E 87783-0001-E 877830001 877830001-E WM23939 |
PRODUCT SPECIFICATION
5.2 MECHANICAL REQUIREMENTS
ITEM
5
DESCRIPTION
Vibration
TEST CONDITION
Amplitude : 1.50mm peak to peak
Sweep : 10-55-10 Hz in one min.
Duration : 2 hrs each on XYZ axis
Module weight : 15g for 244Ckt and 13g for
200Ckt. EIA 364-28
REQUIREMENT
No change in LLCR greater
than 10m ? from initial.
Discontinuity : No greater than
1.0 micro sec.
Mate connectors and shock at 30 g ’ s with
half-sine waveform for 11 milliseconds, 3
No change in LLCR greater
6
Shock
(Mechanical)
shocks in each perpendicular axis (18
shocks total).
Module weight : 15g for 244Ckt and 13g for
than 10m ? from initial.
Discontinuity : No greater than
1.0 micro sec.
200Ckt.
7
8
Durability
Module Insertion
Force
(w/ Latches)
Mate and unmated connectors up to 25
cycles at a maximum rate of 10 cycles per
minute.
Insert a 1.00 mm thick Module(0.10x0.10 mm
chamfer) at a rate of 25 ± 6mm (1 ± inch)
per minute. See Sales drawing for PCB/
Module details.
No change in LLCR greater
than 10 m ? from initial.
Total insertion force not to
exceed :
195.0 N (43.73lbs) for 200 ckt
238.0 N (53.37lbs) for 244 ckt
Apply a pulling force on module card at a rate
9
Module Rip Out
Force
of 25 ± 6 mm/
min. (1 ± ? inch) with recommended test
module as per sales drawing, inserted into
35.0 N (7.85lbs) min. retention
force of the module in
connector with no damage
connector with latches closed.
10
11
12
Latch Actuation
Force
Latch Overstress
Force
Terminal
Retention Force
Apply an actuation force on each latch at a
rate of 25 ± 6 mm/ min (1 ± ? inch) with
recommended test module as per sales
drawing, inserted into connector.
Apply an actuation force on each latch at a
rate of 25 ± 6 mm / min (1 ± ? inch) in the
fully open position.
Axial pullout force on the terminal in the
housing at a rate of 25 ± 6 mm (1 ± ? inch)
per minute.
The force to fully actuate the
latch open shall be 35 N
(7.85lbs) max. per latch.
35 N (7.85lbs) min force with
no damage.
3 N minimum
REVISION: ECR/ECN INFORMATION: TITLE:
SHEET No.
B
EC No:
DATE:
S2007-1019
2007/05/17
22.5 ° Angle Mini DIMM, SMT Connector
200/244Ckt, 0.60mm Pitch
3 of 6
DOCUMENT NUMBER:
PS-87783-001
CREATED / REVISED BY:
CM TEO 2007/05/17
CHECKED BY:
YT YANG 2007/05/25
APPROVED BY:
SH LENI 2007/05/25
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 87783-0001 | 制造商:Molex 功能描述:DIMM Socket |
| 87783-0002 | 功能描述:DDR3 / DDR2 / DDR 连接器 .6MM MINIDIMM SCKT 2.5V RoHS:否 制造商:Molex 产品类型:DIMM 系列:78588 节距:1 mm 位置/触点数量:240 安装风格:Through Hole 安装角:Vertical 外壳材料:Thermoplastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:29 V 电流额定值:1 A 长度: |
| 87783-0201 | 功能描述:DDR3 / DDR2 / DDR 连接器 0.6MM MINIDIMM 200P 22.5 DEG 0.76AU RoHS:否 制造商:Molex 产品类型:DIMM 系列:78588 节距:1 mm 位置/触点数量:240 安装风格:Through Hole 安装角:Vertical 外壳材料:Thermoplastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:29 V 电流额定值:1 A 长度: |
| 87783-0202 | 功能描述:DDR3 / DDR2 / DDR 连接器 .6MM MINIDIMM SCKT 2.5V RoHS:否 制造商:Molex 产品类型:DIMM 系列:78588 节距:1 mm 位置/触点数量:240 安装风格:Through Hole 安装角:Vertical 外壳材料:Thermoplastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:29 V 电流额定值:1 A 长度: |
| 877830301 | 制造商:Molex 功能描述: |
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