参数资料
型号: 89HPES12T3G2ZABC
厂商: INTEGRATED DEVICE TECHNOLOGY INC
元件分类: 总线控制器
英文描述: 12-Lane 3-Port Gen2 PCI Express Switch
中文描述: PCI BUS CONTROLLER, PBGA324
封装: 19 X 19 MM, 1 MM PITCH, CABGA-324
文件页数: 1/31页
文件大小: 291K
代理商: 89HPES12T3G2ZABC
1 of 31
September 4, 2007
2007 Integrated Device Technology, Inc.
*Notice: The information in this document is subject to change without notice
DSC 6930
A
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
Devic e Overview
The 89HPES12T3G2 is a member of IDT’s PRECISE famly of PCI
Expressswitching solutions. The PES12T3G2 is a 12-lane, 3-port
Gen2 peripheral chip that performs PCI Express Base switching with a
feature set optimzed for high performance applications such as servers,
storage, and communications/networking. It provides connectivity and
switching functions between a PCI Express upstreamport and two
downstreamports and supports switching between downstreamports.
Features
High Performance PCI Express Switch
Twelve 5 Gbps Gen2 PCI Express lanes
Three switch ports
One x4 upstreamport
Two x4 downstreamports
Low latency cut-through switch architecture
Support for Max Payload Size up to 2048 bytes
One virtual channel
Eight traffic classes
PCI Express Base Specification Revision 2.0 compliant
Flexible Architecture with Numerous Configuration Options
Automatic per port link width negotiation to x4, x2 or x1
Automatic lane reversal on all ports
Automatic polarity inversion
Ability to load device configuration fromserial EEPROM
Legacy Support
PCI compatible INTx emulation
Bus locking
Highly Integrated Solution
Incorporates on-chip internal memory for packet buffering and
queueing
Integrates twelve 5 Gbps embedded SerDes with 8b/10b
encoder/decoder (no separate transceivers needed)
Receive equalization (RxEQ)
Reliability, Availability, and Serviceability (RAS) Features
Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
Supports ECRC and Advanced Error Reporting
Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
Compatible with Hot-Plug I/O expanders used on PC mother-
boards
Supports Hot-Swap
Power Management
Utilizes advanced low-power design techniques to achieve low
typical power consumption
Support PCI Express Power Management Interface specifica-
tion (PCI-PM2.0)
Block Diagram
Figure 1 Internal Block Diagram
3-Port Switch Core / 12 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
SerDes
Phy
Logical
Layer
Multiplexer / Demultiplexer
Transaction Layer
Data Link Layer
(Port 0)
(Port 2)
Multiplexer / Demultiplexer
Transaction Layer
Data Link Layer
(Port 4)
SerDes
Phy
Logical
Layer
SerDes
Phy
Logical
Layer
Multiplexer / Demultiplexer
Transaction Layer
Data Link Layer
89HPES12T3G2
Data Sheet
Advance Information*
12-Lane 3-Port
Gen2 PCI Express Switch
相关PDF资料
PDF描述
89HPES12T3G2ZABCG 12-Lane 3-Port Gen2 PCI Express Switch
89HPES16NT2 16-Lane 2-Port Non-Transparent PCI Express㈢ Switch
89HPES16T4G2 16-Lane 4-Port Gen2 PCI Express Switch
89HPES16T4G2ZABX 16-Lane 4-Port Gen2 PCI Express Switch
89HPES16T4G2ZABXG 16-Lane 4-Port Gen2 PCI Express Switch
相关代理商/技术参数
参数描述
89HPES12T3G2ZABC8 功能描述:开关 IC - 各种 RoHS:否 制造商:Fairchild Semiconductor 开启电阻(最大值): 电源电压-最大:4.4 V 电源电压-最小:2.5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:WLCSP-9 封装:Reel
89HPES12T3G2ZABCG 功能描述:接口-I/O扩展器 RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel
89HPES12T3G2ZABCG8 功能描述:开关 IC - 各种 RoHS:否 制造商:Fairchild Semiconductor 开启电阻(最大值): 电源电压-最大:4.4 V 电源电压-最小:2.5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:WLCSP-9 封装:Reel
89HPES12T3G2ZBBC 功能描述:Switch Interfacing Interface 324-CABGA (19x19) 制造商:idt, integrated device technology inc 系列:PRECISE?? 包装:托盘 零件状态:有效 应用:开关接口 接口:PCI Express 电压 - 电源:3.3V 封装/外壳:324-LBGA 供应商器件封装:324-CABGA(19x19) 安装类型:表面贴装 标准包装:84
89HPES12T3G2ZBBC8 功能描述:开关 IC - 各种 RoHS:否 制造商:Fairchild Semiconductor 开启电阻(最大值): 电源电压-最大:4.4 V 电源电压-最小:2.5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:WLCSP-9 封装:Reel