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参数资料
| 型号： | 935261652118 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | SPECIALTY MICROPROCESSOR CIRCUIT, PDSO28 |
| 封装： | 7.50 MM, PLASTIC, SO-28 |
| 文件页数： | 8/31页 |
| 文件大小： | 176K |
| 代理商： | 935261652118 |
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1999 Oct 12
16
Philips Semiconductors
Product specication
IC card interface
TDA8002C
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); note 1.
Note
1. Stress beyond these levels may cause permanent damage to the device. This is a stress rating only and functional
operation of the device under this condition is not implied.
HANDLING
Every pin withstands the ESD test according to MIL-STD-883C class 3 for card contacts, class 2 for the remaining.
Method 3015 (HBM 1500
, 100 pF) 3 positive pulses and 3 negative pulses on each pin with respect to ground.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDDD
digital supply voltage
0.3
+6.5
V
VDDA
analog supply voltage
0.3
+6.5
V
VCC
card supply voltage pins;
XTAL1, XTAL2, ALARM, CS, MODE,
RSTIN, CLKSEL, AUX2UC, AUX1UC,
CLKDIV1, CLKDIV2, CLKOUT,
STROBE, CMDVCC, CV/TV and OFF
0.3
+6.5
V
Vi(card)
input voltage on card contact pins;
I/O, AUX2, PRES, PRES, AUX1, CLK,
RST and VCC
0.3
+6.5
V
Ves
electrostatic handling voltage
on pins I/O, AUX2, PRES, PRES,
AUX1, CLK, RST and VCC
6+6
kV
on all other pins
2+2
kV
Tstg
storage temperature
55
+125
°C
Ptot
continuous total power dissipation
TDA8002CT/x
Tamb = 25 to +85 °C
0.56
W
TDA8002CG
Tamb = 25 to +85 °C
0.46
W
Tamb
ambient temperature
25
+85
°C
Tj
junction temperature
150
°C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
in free air
SOT136-1
70
K/W
SOT401-1
91
K/W
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