- 您现在的位置：买卖IC网 > PDF目录122717 > 935262403118 (NXP SEMICONDUCTORS) 0 TIMER(S), REAL TIME CLOCK, PDSO8 PDF资料下载
参数资料
| 型号： | 935262403118 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 时钟/数据恢复及定时提取 |
| 英文描述： | 0 TIMER(S), REAL TIME CLOCK, PDSO8 |
| 封装： | 3 MM, PLASTIC, TSSOP-8 |
| 文件页数： | 18/32页 |
| 文件大小： | 711K |
| 代理商： | 935262403118 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页当前第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页
Philips Semiconductors
PCF8563
Real-time clock/calendar
Product specication
16 April 1999
25 of 30
9397 750 04855
Philips Electronics N.V. 1999. All rights reserved.
14. Soldering
14.1 Introduction
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering is often
preferred when through-hole and surface mount components are mixed on one
printed-circuit board. However, wave soldering is not always suitable for surface
mount ICs, or for printed-circuit boards with high population densities. In these
situations reow soldering is often used.
14.2 Surface mount packages
14.2.1
Reow soldering
Reow soldering requires solder paste (a suspension of ne solder particles, ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reowing; for example, infrared/convection heating in a
conveyor type oven. Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating method.
Typical reow peak temperatures range from 215 to 250
°C. The top-surface
temperature of the packages should preferable be kept below 230
°C.
14.2.2
Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45° angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
相关PDF资料 |
PDF描述 |
|---|---|
| 935261475512 | 8 CHANNEL(S), 500K bps, SERIAL COMM CONTROLLER, PQCC84 |
| 9LPRS365BKLF | SPECIALTY MICROPROCESSOR CIRCUIT, PQCC64 |
| 91W-G28AC-6-CG9 | SINGLE COLOR DISPLAY CLUSTER, GREEN, 7.1 mm |
| 91W-G5AC-6-CW0 | SINGLE COLOR DISPLAY CLUSTER, GREEN, 7.1 mm |
| 94W-EAY2-S0 | SINGLE COLOR LED, AMBER, 8.5 mm |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 935264217557 | 制造商:NXP Semiconductors 功能描述:SUB ONLY IC |
| 935267356112 | 制造商:NXP Semiconductors 功能描述:IC TEA1507PN |
| 935268081112 | 制造商:NXP Semiconductors 功能描述:SUB ONLY IC |
| 935268721125 | 制造商:NXP Semiconductors 功能描述:Buffer/Line Driver 1-CH Non-Inverting 3-ST CMOS 5-Pin TSSOP T/R |
| 935269304128 | 制造商:ST-Ericsson 功能描述:IC AUDIO CODEC W/TCH SCRN 48LQFP |
发布紧急采购，3分钟左右您将得到回复。