参数资料
型号: 93C66BXT-I/ST
元件分类: PROM
英文描述: 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
封装: 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8
文件页数: 5/30页
文件大小: 550K
代理商: 93C66BXT-I/ST
2008 Microchip Technology Inc.
DS21795D-page 13
93AA66A/B/C, 93LC66A/B/C, 93C66A/B/C
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
Example:
6-Lead SOT-23
8-Lead MSOP (150 mil)
Example:
XXXXXXT
YWWNNN
3L66BI
5281L7
XXNN
3EL7
T/XXXNNN
XXXXXXXX
YYWW
8-Lead PDIP
8-Lead SOIC
XXXXYYWW
XXXXXXXT
NNN
XXXX
TYWW
8-Lead TSSOP
NNN
I/P
1L7
93LC66B
0528
Example:
SN
0528
93LC66BI
1L7
L66B
I528
Example:
3
e
3
e
8-Lead 2x3 DFN
Example:
374
528
L7
XXX
YWW
NN
相关PDF资料
PDF描述
93LC66B-I/SN 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
93LC66AT-E/MS 512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8
93AA66AT-I/SNG 512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8
93AA66BT-I/STG 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
93AA66BX-I/ST 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
相关代理商/技术参数
参数描述
93C66BXTISTG 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:4K Microwire Compatible Serial EEPROM
93C66C 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:4K Microwire Compatible Serial EEPROM
93C66C/S15K 制造商:Microchip Technology Inc 功能描述:4K, 512 X 8 OR 256 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film
93C66C/W15K 制造商:Microchip Technology Inc 功能描述:4K, 512 X 8 OR 256 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film
93C66C/WF15K 制造商:Microchip Technology Inc 功能描述:4K, 512 X 8 OR 256 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film