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| 型号： | 9DB306BFLF |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | 时钟及定时 |
| 英文描述： | 9DB SERIES, PLL BASED CLOCK DRIVER, 6 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO28 |
| 封装： | 5.30 X 10.20 MM, 1.75 MM HEIGHT, ROHS COMPLIANT, MO-150, SSOP-28 |
| 文件页数： | 3/17页 |
| 文件大小： | 268K |
| 代理商： | 9DB306BFLF |
ICS9DB306BL REVISION C AUGUST 13, 2009
11
2009 Integrated Device Technology, Inc.
ICS9DB306 Data Sheet
PCI EXPRESS JITTER ATTENUATOR
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS9DB306.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS9DB306 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.3V + 10% = 3.63V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.63V * 135mA = 490.1mW
Power (outputs)
MAX
= 30mW/Loaded Output pair
If all outputs are loaded, the total power is 6 * 30mW = 180mW
Total Power
_MAX
(3.63V, with all outputs switching) = 490.1mW + 180mW = 670.1mW
2. Junction Temperature.
Junction temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The maximum
recommended junction temperature for HiPerClockS
TM devices is 125°C. Limiting the internal transistor junction temperature, Tj, to
125°C ensures that the bond wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 43.9°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.670W * 43.9°C/W = 99.4°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow, and
the type of board (single layer or multi-layer).
θθθθθ
JA
by Velocity (Linear Feet per Minute)
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
82.9°C/W
68.7°C/W
60.5°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
49.8°C/W
43.9°C/W
41.2°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TABLE 6. THERMAL RESISTANCE
θθθθθ
JA
FOR
28-PIN TSSOP, FORCED CONVECTION
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 9DB306BFT | 制造商:Integrated Device Technology Inc 功能描述:9DB306BFT - Tape and Reel |
| 9DB306BL | 制造商:Integrated Device Technology Inc 功能描述:PCI EXPRESS, JITTER ATTENUATOR. TSSOP28 - Rail/Tube |
| 9DB306BLI | 制造商:Integrated Device Technology Inc 功能描述:ZERO DLY PLL CLOCK BFFR SGL 28TSSOP - Rail/Tube |
| 9DB306BLILF | 功能描述:IC JITTER ATTENUATOR 28-TSSOP 制造商:idt, integrated device technology inc 系列:- 包装:管件 零件状态:过期 PLL:是 主要用途:PCI Express（PCIe） 输入:HCSL，LVDS，LVHSTL，LVPECL，SSTL 输出:LVPECL 电路数:1 比率 - 输入:输出:1：6 差分 - 输入:输出:是/是 频率 - 最大值:140MHz 电压 - 电源:2.97 V ~ 3.63 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:28-TSSOP（0.173"，4.40mm 宽） 供应商器件封装:28-TSSOP 标准包装:50 |
| 9DB306BLILFT | 功能描述:IC JITTER ATTENUATOR 28-TSSOP 制造商:idt, integrated device technology inc 系列:- 包装:带卷（TR） 零件状态:过期 PLL:是 主要用途:PCI Express（PCIe） 输入:HCSL，LVDS，LVHSTL，LVPECL，SSTL 输出:LVPECL 电路数:1 比率 - 输入:输出:1：6 差分 - 输入:输出:是/是 频率 - 最大值:140MHz 电压 - 电源:2.97 V ~ 3.63 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:28-TSSOP（0.173"，4.40mm 宽） 供应商器件封装:28-TSSOP 标准包装:1,000 |
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