
Linear Hall Effect Sensor ICs with Analog Output
A1324, A1325,
and A1326
2
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Absolute Maximum Ratings
Characteristic
Symbol
Notes
Rating
Unit
Forward Supply Voltage
VCC
8V
Reverse Supply Voltage
VRCC
–0.1
V
Forward Output Voltage
VOUT
15
V
Reverse Output Voltage
VROUT
–0.1
V
Output Source Current
IOUT(SOURCE)
VOUT to GND
2
mA
Output Sink Current
IOUT(SINK)
VCC to VOUT
10
mA
Operating Ambient Temperature
TA
L temperature range
–40 to 150
C
Maximum Junction Temperature
TJ(max)
165
C
Storage Temperature
Tstg
–65 to 170
C
Terminal List Table
Name
Number
Function
LH
UA
VCC
1
Input power supply; tie to GND with
bypass capacitor
VOUT
2
3
Output signal; also used for
programming
GND
3
2
Ground
Selection Guide
Part Number
Packing1
Package
Sensitivity (Typ.)
(mV/G)
A1324LLHLX-T
10 000 pieces per reel
3-pin SOT-23W surface mount
5.000
A1324LUA-T2
500 pieces per bag
3-pin ultramini SIP through hole mount
A1325LLHLX-T
10 000 pieces per reel
3-pin SOT-23W surface mount
3.125
A1325LUA-T2
500 pieces per bag
3-pin ultramini SIP through hole mount
A1326LLHLX-T
10 000 pieces per reel
3-pin SOT-23W surface mount
2.500
A1326LUA-T2
500 pieces per bag
3-pin ultramini SIP through hole mount
1Contact Allegro for additional packing options.
2Contact factory for availability.
Thermal Characteristics may require derating at maximum conditions, see application information
Characteristic
Symbol
Test Conditions*
Value
Unit
Package Thermal Resistance
RθJA
Package LH, on 4-layer PCB with copper limited to solder pads
228
C/W
Package LH, on 2-layer PCB with 0.463 in.2 of copper area each
side, connected by thermal vias
110
C/W
Package UA, on 1-layer PCB with copper limited to solder pads
165
C/W
*Additional thermal information available on the Allegro website
23
1
2
1
3
Pin-out Diagrams
LH Package
UA Package