参数资料
型号: A14V15A-PL84C
厂商: Microsemi SoC
文件页数: 7/90页
文件大小: 0K
描述: IC FPGA 1500 GATES 3.3V 84-PLCC
标准包装: 16
系列: ACT™ 3
LAB/CLB数: 200
输入/输出数: 70
门数: 1500
电源电压: 3 V ~ 3.6 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 84-LCC(J 形引线)
供应商设备封装: 84-PLCC(29.31x29.31)
Accelerator Series FPGAs – ACT 3 Family
R e visio n 3
2 -7
Antifuse Connections
An antifuse is a “normally open” structure as opposed to the normally closed fuse structure used in
PROMs or PALs. The use of antifuses to implement a programmable logic device results in highly
testable structures as well as an efficient programming architecture. The structure is highly testable
because there are no preexisting connections; temporary connections can be made using pass
transistors. These temporary connections can isolate individual antifuses to be programmed as well as
isolate individual circuit structures to be tested. This can be done both before and after programming. For
example, all metal tracks can be tested for continuity and shorts between adjacent tracks, and the
functionality of all logic modules can be verified.
Four types of antifuse connections are used in the routing structure of the ACT 3 array. (The physical
structure of the antifuse is identical in each case; only the usage differs.)
Table 2-1 shows four types of antifuses.
Examples of all four types of connections are shown in Figure 2-7 on page 2-6 and Figure 2-8 on
Module Interface
Connections to Logic and I/O modules are made through vertical segments that connect to the module
inputs and outputs. These vertical segments lie on vertical tracks that span the entire height of the array.
Module Input Connections
The tracks dedicated to module inputs are segmented by pass transistors in each module row. During
normal user operation, the pass transistors are inactive, which isolates the inputs of a module from the
inputs of the module directly above or below it. During certain test modes, the pass transistors are active
to verify the continuity of the metal tracks. Vertical input segments span only the channel above or the
channel below. The logic modules are arranged such that half of the inputs are connected to the channel
above and half of the inputs to segments in the channel below, as shown in Figure 2-9.
Table 2-1 Antifuse Types
Type
Description
XF
Horizontal-to-vertical connection
HF
Horizontal-to-horizontal connection
VF
Vertical-to-vertical connection
FF
"Fast" vertical connection
Figure 2-9
Logic Module Routing Interface
Y+2
Y+1
A1 D10 D11
B1 B0
D01 D00
Y-1
Y-2
LVTs
Y+2
Y+1
Y
Y-1
Y-2
C-Modules
S-Modules
D10
B0
A0 D11 A1
B1 D01
A0
Y
相关PDF资料
PDF描述
A14V15A-PLG84C IC FPGA 1500 GATES 3.3V 84-PLCC
5745172-3 CONN BACKSHELL DB15 DIE CAST
AFS250-1PQ208I IC FPGA 2MB FLASH 250K 208PQFP
A10V10B-VQ80C IC FPGA 1200 GATES 80-VQFP COM
1-176793-0 CONN SHIELD CASE .050 80POS WHT
相关代理商/技术参数
参数描述
A14V15A-PLG84C 功能描述:IC FPGA 1500 GATES 3.3V 84-PLCC RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ACT™ 3 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A14V15A-VQ100C 功能描述:IC FPGA 1500 GATES 3.3V 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ACT™ 3 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A14V15A-VQG100C 功能描述:IC FPGA 1500 GATES 3.3V 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ACT™ 3 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A14V25AA-1BG208B 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:Accelerator Series FPGAs - ACT 3Family
A14V25AA-1BG208C 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:Accelerator Series FPGAs - ACT 3Family