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参数资料
型号： A14V60A-PQ208C
厂商： Microsemi SoC
文件页数： 4/90页
文件大小： 0K
描述： IC FPGA 6K GATES 3.3V 208-PQFP
标准包装： 24
系列： ACT™ 3
LAB/CLB数： 848
输入/输出数： 167
门数： 6000
电源电压： 3 V ~ 3.6 V
安装类型： 表面贴装
工作温度： 0°C ~ 70°C
封装/外壳： 208-BFQFP
供应商设备封装： 208-PQFP（28x28）
Detailed Specifications
2- 4
R e v ision 3
The I/O module output Y is used to bring Pad signals into the array or to feed the output register back into
the array. This allows the output register to be used in high-speed state machine applications. Side I/O
modules have a dedicated output segment for Y extending into the routing channels above and below
(similar to logic modules). Top/Bottom I/O modules have no dedicated output segment. Signals coming
into the chip from the top or bottom are routed using F-fuses and LVTs (F-fuses and LVTs are explained
in detail in the routing section).
I/O Pad Drivers
All pad drivers are capable of being tristate. Each buffer connects to an associated I/O module with four
signals: OE (Output Enable), IE (Input Enable), DataOut, and DataIn. Certain special signals used only
during programming and test also connect to the pad drivers: OUTEN (global output enable), INEN
(global input enable), and SLEW (individual slew selection). See Figure 2-5.
Special I/Os
The special I/Os are of two types: temporary and permanent. Temporary special I/Os are used during
programming and testing. They function as normal I/Os when the MODE pin is inactive. Permanent
special I/Os are user programmed as either normal I/Os or special I/Os. Their function does not change
once the device has been programmed. The permanent special I/Os consist of the array clock input
buffers (CLKA and CLKB), the hard-wired array clock input buffer (HCLK), the hard-wired I/O clock input
buffer (IOCLK), and the hard-wired I/O register preset/clear input buffer (IOPCL). Their function is
determined by the I/O macros selected.
Clock Networks
The ACT 3 architecture contains four clock networks: two high-performance dedicated clock networks
and two general purpose routed networks. The high-performance networks function up to 200 MHz,
while the general purpose routed networks function up to 150 MHz.
Figure 2-5
Function Diagram for I/O Pad Driver
PAD
OE
SLEW
DATAOUT
DATAIN
IEN
INEN
OUTEN
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A14V60A-PQG160C 功能描述:IC FPGA 6K GATES 3.3V 160-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ACT™ 3 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP，带拉杆 供应商设备封装:352-CQFP（75x75）
A14V60A-PQG208C 功能描述:IC FPGA 6K GATES 3.3V 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ACT™ 3 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP，带拉杆 供应商设备封装:352-CQFP（75x75）
A14V60A-TQ176C 功能描述:IC FPGA 6K GATES 3.3V 176-TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ACT™ 3 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP，带拉杆 供应商设备封装:352-CQFP（75x75）
A14V60A-TQG176C 功能描述:IC FPGA 6K GATES 3.3V 176-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ACT™ 3 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP，带拉杆 供应商设备封装:352-CQFP（75x75）
A15 制造商:Industrial Timer Company (ITC) 功能描述:Timer-Counter Display Panel
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