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参数资料
| 型号： | A3906SESTR-T |
| 厂商： | Allegro Microsystems Inc |
| 文件页数： | 8/10页 |
| 文件大小： | 0K |
| 描述： | IC DVR DC/STEP MOTOR DUAL 20-QFN |
| 标准包装： | 1 |
| 应用： | 直流电机驱动器，步进电机驱动器 |
| 输出数： | 2/1 |
| 电流 - 输出： | ± 1A |
| 电源电压： | 2.5 V ~ 9 V |
| 工作温度： | -20°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-WFQFN 裸露焊盘 |
| 供应商设备封装： | 20-QFN 裸露焊盘（4x4） |
| 包装： | 标准包装 |
| 产品目录页面： | 1140 (CN2011-ZH PDF) |
| 其它名称： | 620-1288-6 |
A3906
Low Voltage Stepper and Single/Dual DC Motor Driver
Parallel Operation The A3906 can be paralleled for applica-
tions that require higher output currents. In paralleled mode the
driver can source 2 A continuous. The A3906 has two completely
independent bridges with separate overcurrent latches. This
allows the device to supply two separate loads, and as a result,
when paralleled it is imperative that the internal current control is
disabled by shorting the sense pins to ground.
Because the overcurrent trip threshold is internally fixed at 0.2 V,
the trace resistance must be kept small so the internal current
latch is not triggered prematurely. With acceptable margin, the
voltage drop across the trace resistance should be under 0.1 V. At
a peak current of 2.5 A, the trace resistance should be kept below
40 m Ω to prevent false tripping of the overcurrent latch.
Each bridge has some variation in propagation delay. During this
time it is possible that one bridge will have to support the full
0.1 μ F
0.1 μ F
load current for a very short period of time. Propagation delays
are characterized and guard banded to protect the driver from
damage during these events.
Layout The printed circuit board should use a heavy ground-
plane. For optimum electrical and thermal performance, the
A3906 must be soldered directly onto the board. On the under-
side of the A3906 package is an exposed pad, which provides a
path for enhanced thermal dissipation. The thermal pad should be
soldered directly to an exposed surface on the PCB. Thermal vias
are used to transfer heat to other layers of the PCB.
Grounding In order to minimize the effects of ground bounce
and offset issues, it is important to have a low impedance single-
point ground, known as a star ground , located very close to the
device. By making the connection between the exposed thermal
pad and the ground plane directly under the A3906, that area
0.1 μ F
10 μ F
10 V
VBB
GND
IN1
OUT1A
OUT1B
IN2
IN3
IN4
SLEEP
FL1
FL2
DC Motor Operation (Parallel Bridge)
A3906
OUT2A
OUT2B
SENSE1
SENSE2
IN1/IN3
0
1
0
1
IN2/IN4
0
0
1
1
OUT1A/2A
OFF
H
L
L
OUT1B/2B
OFF
L
H
L
Function
Disabled
FOR
REV
BRAKE
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
8
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