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参数资料
| 型号： | A3983SLP-T |
| 厂商： | Allegro Microsystems Inc |
| 文件页数： | 7/13页 |
| 文件大小： | 0K |
| 描述： | IC MICRO STEPPING DRIVER 24-TSSO |
| 标准包装： | 62 |
| 应用： | 步进电机驱动器 |
| 输出数： | 1 |
| 电流 - 输出： | ±2A |
| 电压 - 负载： | 8 V ~ 35 V |
| 电源电压： | 3 V ~ 5.5 V |
| 工作温度： | -20°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-TSSOP（0.173"，4.40mm）裸露焊盘 |
| 供应商设备封装： | 24-TSSOP 裸露焊盘 |
| 包装： | 管件 |
| 其它名称： | 620-1083 |
A3983
DMOS Microstepping Driver with Translator
Application Layout
Layout . The printed circuit board should use a heavy ground-
plane. For optimum electrical and thermal performance, the
A3983 must be soldered directly onto the board. On the under-
side of the A3983 package is an exposed pad, which provides a
path for enhanced thermal dissipation. The thermal pad should be
soldered directly to an exposed surface on the PCB. Thermal vias
are used to transfer heat to other layers of the PCB.
In order to minimize the effects of ground bounce and offset
issues, it is important to have a low impedance single-point
ground, known as a star ground , located very close to the device.
By making the connection between the pad and the ground plane
directly under the A3983, that area becomes an ideal location for
a star ground point. A low impedance ground will prevent ground
bounce during high current operation and ensure that the supply
voltage remains stable at the input terminal. The star ground can
be created using the exposed thermal pad under the device, to
serve both as a low impedance ground point and thermal path.
The two input capacitors should be placed in parallel, and as
close to the device supply pins as possible. The ceramic capaci-
tor (CIN1) should be closer to the pins than the bulk capacitor
(CIN2). This is necessary because the ceramic capacitor will be
responsible for delivering the high frequency current components.
The sense resistors, RSx , should have a very low impedance
path to ground, because they must carry a large current while
supporting very accurate voltage measurements by the current
sense comparators. Long ground traces will cause additional
voltage drops, adversely affecting the ability of the comparators
to accurately measure the current in the windings. The SENSEx
pins have very short traces to the RSx resistors and very thick,
low impedance traces directly to the star ground underneath the
device. If possible, there should be no other components on the
sense circuits.
PCB
Thermal Vias
A3983
OUT2B
Solder
Trace (2 oz.)
Signal (1 oz.)
Ground (1 oz.)
Thermal (2 oz.)
GND
C5
ROSC
C4
C3
U1
GND
C6
R4
R5
GND
OUT2A
OUT1A
C3
C4
C5
CP1
CP2
VCP
VREG
MS1
A3983
PAD
GND
ENABLE
OUT2B
VBB2
SENSE2
OUT2A
R4
C6
C1
GND
GND
GND
BULK
GND
OUT1B
C1
ROSC
MS2
RESET
ROSC
SLEEP
VDD
STEP
OUT1A
SENSE1
VBB1
OUT1B
DIR
R5
C2
CAPACITANCE
GND
V DD
REF
GND
V BB
C2
VDD
VBB
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
7
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相关代理商/技术参数 |
参数描述 |
|---|---|
| A3983SLP-T | 制造商:Allegro MicroSystems LLC 功能描述:Motor Driver IC |
| A3983SLPTR | 功能描述:IC DRIVER MICROSTEPPING 24-TSSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 电机和风扇控制器，驱动器 系列:- 标准包装:1 系列:- 应用:直流电机驱动器，步进电机驱动器 评估套件:- 输出数:1 或 2 电流 - 输出:750mA 电压 - 负载:10 V ~ 40 V 电源电压:4.5 V ~ 5.5 V 工作温度:-20°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-BFSOP（0.295"，7.50mm 宽） 供应商设备封装:24-SOP 包装:Digi-Reel® 其它名称:MTS62C19A-HS105DKR |
| A3983SLPTR-T | 功能描述:IC DRIVER MICROSTEPPING 24-TSSOP RoHS:是 类别:集成电路 (IC) >> PMIC - 电机和风扇控制器，驱动器 系列:- 标准包装:1 系列:- 应用:步进电机驱动器，1-2 相，2 相 评估套件:- 输出数:1 电流 - 输出:800mA 电压 - 负载:10 V ~ 28 V 电源电压:4.75 V ~ 5.25 V 工作温度:-20°C ~ 90°C 安装类型:表面贴装 封装/外壳:28-SOP + 2 翼片裸露焊盘 供应商设备封装:28-HSOPHC（15.2x7.9） 包装:剪切带 (CT) 其它名称:869-1268-1 |
| A3984 | 制造商:ALLEGRO 制造商全称:Allegro MicroSystems 功能描述:DMOS Microstepping Driver with Translator |
| A3984_08 | 制造商:ALLEGRO 制造商全称:Allegro MicroSystems 功能描述:The A3984 is a complete microstepping motor driver with built-in translator for easy operation. |
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