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参数资料
型号： A3P125-TQG144II
元件分类： FPGA
英文描述： FPGA, 3072 CLBS, 125000 GATES, 350 MHz, PQFP144
封装： 20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, GREEN, TQFP-144
文件页数： 25/49页
文件大小： 5893K
代理商： A3P125-TQG144II
ProASIC3 DC and Switching Characteristics
2- 104
v1.3
Part Number and Revision Date
Part Number 51700097-002-3
Revised August 2008
List of Changes
The following table lists critical changes that were made in the current version of the chapter.
Previous Version
Changes in Current Version (v1.3)
Page
v1.2
(June 2008)
TJ, Maximum Junction Temperature, was changed to 100° from 110 in the
"Thermal Characteristics" section and EQ 2-2. The calculated result of Maximum
Power Allowed has thus changed to 1.463 W from 1.951 W.
2-5
Values for the A3P015 device were added to Table 2-7 Quiescent Supply
Current Characteristics.
2-6
Values for the A3P015 device were added to Table 2-14 Different Components
Contributing to Dynamic Power Consumption in ProASIC3 Devices. PAC14 was
removed. Table 2-15 Different Components Contributing to the Static Power
Consumption in ProASIC3 Devices is new.
2-10,
2-11
The "PLL Contribution—PPLL" section was updated to change the PPLL formula
from PAC13 + PAC14 * FCLKOUT to PDC4 + PAC13 * FCLKOUT.
2-13
Both fall and rise values were included for tDDRISUD and tDDRIHD in
Table 2-93 Input DDR Propagation Delays.
2-71
Table 2-98 A3P015 Global Resource is new.
2-79
The typical value for Delay Increments in Programmable Delay Blocks was
changed from 160 to 200 in Table 2-106 ProASIC3 CCC/PLL Specification.
2-83
v1.1
(January 2008)
Table note references were added to Table 2-2 Recommended Operating
Conditions 1, and the order of the table notes was changed.
2-2
The title for Table 2-4 Overshoot and Undershoot Limits 1 was modified to
remove "as measured on quiet I/Os." Table note 1 was revised to remove
"estimated SSO density over cycles." Table note 2 was revised to remove "refers
only to overshoot/undershoot limits for simultaneous switching I/Os.
"
2-3
The "Power per I/O Pin" section was updated to include 3 additional tables
pertaining to input buffer power and output buffer power.
2-6
Table 2-29 I/O Output Buffer Maximum Resistances 1 was revised to include
values for 3.3 V PCI/PCI-X.
2-24
Table 2-81 LVDS Minimum and Maximum DC Input and Output Levels was
updated.
2-59
v1.0
(January 2008)
In Table 2-2 Recommended Operating Conditions 1, TJ was listed in the symbol
column and was incorrect. It was corrected and changed to TA.
2-2
In Table 2-3 Flash Programming Limits – Retention, Storage and Operating
Temperature1, Maximum Operating Junction Temperature was changed from
110°C to 100°C for both commercial and industrial grades.
2-2
The "PLL Behavior at Brownout Condition" section is new.
2-3
In the "PLL Contribution—PPLL" section, the following was deleted:
FCLKIN is the input clock frequency.
2-13
In Table 2-21 Summary of Maximum and Minimum DC Input Levels, the note
was incorrect. It previously said TJ and it was corrected and changed to TA.
2-20
相关PDF资料
PDF描述
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相关代理商/技术参数
参数描述
A3P125-VQ100 功能描述:IC FPGA 1KB FLASH 125K 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
A3P125-VQ100I 功能描述:IC FPGA 1KB FLASH 125K 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
A3P125-VQ100T 功能描述:IC FPGA 1KB FLASH 125K 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
A3P125-VQ144 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs
A3P125-VQ144ES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs
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