参数资料
| 型号： | A3P600-PQG208 |
| 厂商： | Microsemi SoC |
| 文件页数： | 21/27页 |
| 文件大小： | 0K |
| 描述： | IC FPGA 235I/O 208PQFP |
| 标准包装： | 24 |
| 系列： | ProASIC3 |
| RAM 位总计： | 110592 |
| 输入/输出数： | 154 |
| 门数： | 600000 |
| 电源电压： | 1.425 V ~ 1.575 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 208-BFQFP |
| 供应商设备封装： | 208-PQFP（28x28） |
| 其它名称： | 1100-1036 |
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www.microsemi.com/soc
Whether you’re designing at the board or system level,
Microsemi’s customizable System-on-Chip (cSoC) devices and low
power FPGAs are your best choice. The unique, flash-based technology of Microsemi FPGAs, coupled with their history of reliability,
sets them apart from traditional FPGAs.
Design for today’s rapidly growing markets of consumer and portable medical devices, or tomorrow’s environmentally friendly data
centers, industrial controls and military and commercial aircraft. Only Microsemi can meet the power, size, cost and reliability targets
that reduce time-to-market and enable long-term profitability.
Now, more than ever,
power matters.
Table of Contents
SmartFusion
Customizable System-on-Chip (cSoC)
4
Fusion
Mixed Signal FPGAs
5
Extended Temperature Fusion
Mixed Signal Integration Down to –55C
Reprogrammable Digital Logic and Configurable Analog
Embedded Flash Memory
6
IGLOO/e
Low Power
Small Package Footprint
High Logic Density
7
IGLOO nano
Low Power
Small Package Footprint
8
IGLOO PLUS
Low Power
Small Package Footprint
High I/O-to-Logic Ratio
9
ProASIC3/E
High Logic Density
High Performance
Low Cost
10
ProASIC3 nano
Small Package Footprint
High Performance
Low Cost
11
ProASIC3L
Low Power
High Logic Density
High Performance
Low Cost
12
Military ProASIC3/EL
Unprecedented Low Power Consumption Across
the Full Military Temperature Range
High-Density Fine-Pitch Ball Grid Packaging
High Performance and Easy In-System Programming
13
Military ProASICPLUS
Industry’s First Military Screened Flash FPGA
Full Processing to MIL-STD-883 Class B
Established Heritage on Commercial and Military Aircraft
13
I/O Table
I/O Counts
14
FPGA Packages
Package Dimensions
16
Axcelerator
18
SX-A
19
MX
20
Design Tools
Design Environment for Microsemi Flash Devices
21
Development Kits
Starter, Evaluation and Demonstration Kits
22
Programmers
FlashPro3 and Silicon Sculptor 3 Programmers
26
Intellectual Property Cores
Microsemi IP Cores
27
Please refer to www.microsemi.com/soc and appropriate product datasheets for the latest device information, valid ordering codes and more
information regarding previous generations of flash and antifuse FPGAs.
相关PDF资料 |
PDF描述 |
|---|---|
| A54SX16A-FFG256 | IC FPGA SX 24K GATES 256-FBGA |
| GBB105DHAN | CONN EDGECARD 210PS R/A .050 SLD |
| A54SX16A-FFGG256 | IC FPGA SX 24K GATES 256-FBGA |
| M1A3P600L-1PQ208 | IC FPGA 1KB FLASH 600K 208-PQFP |
| M1A3P600L-1PQG208 | IC FPGA 1KB FLASH 600K 208-PQFP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| A3P600-PQG208I | 功能描述:IC FPGA 1KB FLASH 600K 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17） |
| A3P600-VQ144 | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
| A3P600-VQ144ES | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
| A3P600-VQ144I | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
| A3P600-VQ144PP | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
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