参数资料
型号: A3P600-PQG208
厂商: Microsemi SoC
文件页数: 23/27页
文件大小: 0K
描述: IC FPGA 235I/O 208PQFP
标准包装: 24
系列: ProASIC3
RAM 位总计: 110592
输入/输出数: 154
门数: 600000
电源电压: 1.425 V ~ 1.575 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 208-BFQFP
供应商设备封装: 208-PQFP(28x28)
其它名称: 1100-1036
5
www.microsemi.com/soc
IntegratedA/Dconverter(ADC)
with8-,10-and12-bit
resolutionand30scalable
analog input channels
ADCaccuracybetterthan
1percent
On-chipvoltage,currentand
temperature monitors
In-systemconfigurable
analog supports a wide
varietyofapplications
Upto1MBofuserflashmemory
Extensiveclockingresources
AnalogPLLs
1percentRCoscillator
Crystaloscillatorcircuit
Real-timecounter(RTC)
FlashFPGAfabric
Reprogrammable
Liveatpower-up
Maximumdesignsecurity
Ultra-lowpower
Configurationmemoryerror
immune
Clockmanagement
AdvancedI/Ostandards
UsernonvolatileFlashROM
Notes:
1. Refer to the Cortex-M1 product brief for more information.
2. Pigeon Point devices only offered in FG484 and FG256 packages.
3. MicroBlade devices only offered in FG256 package.
Notes:
1. Pigeon Point devices only offered in FG484 and FG256 packages.
2. MicroBlade devices only offered in FG256 package.
3. These packages are available only as RoHS-compliant (QNG package specifier).
4. AFS250 and AFS600 PQ208 devices are not pin-compatible.
5. Available in RoHS-compliant and standard leaded packages.
Fusion
Package I/Os: Single-/Double-Ended (Analog)
Fusion Mixed Signal FPGAs
AFS090
AFS250
AFS600
AFS1500
Cortex-M1Devices
M1AFS250
M1AFS600
M1AFS1500
Pigeon Point Devices
P1AFS6001
P1AFS15001
MicroBladeDevices
U1AFS6002
QN1083
37/9 (16)
QN1803
60/16 (20)
65/15 (24)
PQ2084
93/26 (24)
95/46 (40)
FG2565
75/22 (20)
114/37 (24)
119/58 (40)
FG4845
172/86 (40)
223/109 (40)
FG6765
252/126 (40)
Fusion Devices
Theworld’sfirstmixedsignalFPGA
Fusion FPGAs integrate configurable analog, large flash memory blocks, comprehensive clock generation and management circuitry and high-performance,
flash-based programmable logic in a monolithic device. The Fusion architecture can be used with soft microcontroller cores, such as the performance-optimized
ARM Cortex-M1, 8051s or Microsemi’s own CoreABC, the smallest soft microcontroller for FPGAs.
Fusion Devices
AFS090
AFS250
AFS600
AFS1500
Cortex-M1Devices1
M1AFS250
M1AFS600
M1AFS1500
Pigeon Point Devices
P1AFS6002
P1AFS15002
MicroBladeDevices
U1AFS6003
General
Information
System Gates
90,000
250,000
600,000
1,500,000
Tiles(D–flip–flops)
2,304
6,144
13,824
38,400
AES-protected ISP
Yes
PLLs
1
2
Globals
18
Memory
FlashMemoryBlocks(2Mbits)
1
2
4
TotalFlashMemoryBits
2 M
4 M
8 M
FlashROMBits
1,024
RAMBlocks(4,608bits)
6
8
24
60
RAM(Kbits)
27
36
108
270
Analog and I/Os
Analog Quads
5
6
10
Analog Input Channels
15
18
30
Gate Driver Outputs
5
6
10
I/OBanks(+JTAG)
4
5
Maximum Digital I/Os
75
114
172
252
Analog I/Os
20
24
40
Fusion
相关PDF资料
PDF描述
A54SX16A-FFG256 IC FPGA SX 24K GATES 256-FBGA
GBB105DHAN CONN EDGECARD 210PS R/A .050 SLD
A54SX16A-FFGG256 IC FPGA SX 24K GATES 256-FBGA
M1A3P600L-1PQ208 IC FPGA 1KB FLASH 600K 208-PQFP
M1A3P600L-1PQG208 IC FPGA 1KB FLASH 600K 208-PQFP
相关代理商/技术参数
参数描述
A3P600-PQG208I 功能描述:IC FPGA 1KB FLASH 600K 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A3P600-VQ144 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs
A3P600-VQ144ES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs
A3P600-VQ144I 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs
A3P600-VQ144PP 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs