参数资料
型号: A3PE1500-PQ208
厂商: Microsemi SoC
文件页数: 122/162页
文件大小: 0K
描述: IC FPGA 1KB FLASH 1.5M 208-PQFP
标准包装: 24
系列: ProASIC3E
RAM 位总计: 276480
输入/输出数: 147
门数: 1500000
电源电压: 1.425 V ~ 1.575 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 208-BFQFP
供应商设备封装: 208-PQFP(28x28)
ProASIC3E DC and Switching Characteristics
2-48
Revision 13
Differential I/O Characteristics
Physical Implementation
Configuration of the I/O modules as a differential pair is handled by the Designer software when the user
instantiates a differential I/O macro in the design.
Differential I/Os can also be used in conjunction with the embedded Input Register (InReg), Output
Register (OutReg), Enable Register (EnReg), and DDR. However, there is no support for bidirectional
I/Os or tristates with the LVPECL standards.
LVDS
Low-Voltage Differential Signaling (ANSI/TIA/EIA-644) is a high-speed, differential I/O standard. It
requires that one data bit be carried through two signal lines, so two pins are needed. It also requires
external resistor termination.
The full implementation of the LVDS transmitter and receiver is shown in an example in Figure 2-22. The
building blocks of the LVDS transmitter-receiver are one transmitter macro, one receiver macro, three
board resistors at the transmitter end, and one resistor at the receiver end. The values for the three driver
resistors are different from those used in the LVPECL implementation because the output standard
specifications are different.
Along with LVDS I/O, ProASIC3E also supports Bus LVDS structure and Multipoint LVDS (M-LVDS)
configuration (up to 40 nodes).
Figure 2-22 LVDS Circuit Diagram and Board-Level Implementation
140
100
Z0 = 50
165
165
+
P
N
P
N
INBUF_LVDS
OUTBUF_LVDS
FPGA
Bourns Part Number: CAT16-LV4F12
相关PDF资料
PDF描述
M1A3PE1500-PQG208 IC FPGA 1KB FLASH 1.5M 208-PQFP
ASC35DRAI CONN EDGECARD 70POS .100 R/A DIP
ACB35DHBR CONN EDGECARD 70POS R/A .050 DIP
ASC36DRYI-S734 CONN EDGECARD 72POS DIP .100 SLD
ACC50DRTI CONN EDGECARD 100PS .100 DIP SLD
相关代理商/技术参数
参数描述
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