参数资料
型号: A3PN060-2VQ100
厂商: Microsemi SoC
文件页数: 27/114页
文件大小: 0K
描述: IC FPGA NANO 60K GATES 100-VQFP
标准包装: 90
系列: ProASIC3 nano
RAM 位总计: 18432
输入/输出数: 71
门数: 60000
电源电压: 1.425 V ~ 1.575 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 100-TQFP
供应商设备封装: 100-VQFP(14x14)
II
Revision 11
I/Os Per Package
ProASIC3 nano Device Status
ProASIC3 nano Devices
A3PN010
A3PN0151
A3PN020
A3PN060
A3PN125
A3PN250
ProASIC3 nano-Z Devices1
A3PN030Z1
A3PN060Z1 A3PN125Z1 A3PN250Z1
Known Good Die
34
52
83
71
68
QN48
34
34
QN68
49
VQ100
77
717168
Notes:
1. Not recommended for new designs.
2. When considering migrating your design to a lower- or higher-density device, refer to the ProASIC3 FPGA Fabric User’s Guide
to ensure compliance with design and board migration requirements.
3. "G" indicates RoHS-compliant packages. Refer to "ProASIC3 nano Ordering Information" on page III for the location of the "G"
in the part number. For nano devices, the VQ100 package is offered in both leaded and RoHS-compliant versions. All other
packages are RoHS-compliant only.
Table 2 ProASIC3 nano FPGAs Package Sizes Dimensions
Packages
QN48
QN68
VQ100
Length × Width (mm\mm)
6 x 6
8 x 8
14 x 14
Nominal Area (mm2)
36
64
196
Pitch (mm)
0.4
0.5
Height (mm)
0.90
1.20
ProASIC3 nano Devices
Status
ProASIC3 nano-Z Devices
Status
A3PN010
Production
A3PN015
Not recommended for new designs.
A3PN020
Production
A3PN030Z
Not recommended for new designs.
A3PN060
Production
A3PN060Z
Not recommended for new designs.
A3PN125
Production
A3PN125Z
Not recommended for new designs.
A3PN250
Production
A3PN250Z
Not recommended for new designs.
相关PDF资料
PDF描述
A3P015-2QNG68I IC FPGA 1KB FLASH 15K 68-QFN
A3P030-2QNG48I IC FPGA 1KB FLASH 30K 48-QFN
ACM44DSEH CONN EDGECARD 88POS .156 EYELET
A3P030-1QNG68I IC FPGA 1KB FLASH 30K 68-QFN
AGLN020V5-QNG68I IC FPGA NANO 1KB 20K 68-QFN
相关代理商/技术参数
参数描述
A3PN060-2VQ100I 功能描述:IC FPGA NANO 60K GATES 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
A3PN060-2VQG100 功能描述:IC FPGA NANO 60K GATES 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
A3PN060-2VQG100I 功能描述:IC FPGA NANO 60K GATES 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
A3PN060-DIELOT 制造商:Microsemi Corporation 功能描述:A3PN060-DIELOT - Gel-pak, waffle pack, wafer, diced wafer on film
A3PN060-VQ100 功能描述:IC FPGA NANO 60K GATES 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)