参数资料
型号: A3PN060-2VQ100I
厂商: Microsemi SoC
文件页数: 2/114页
文件大小: 0K
描述: IC FPGA NANO 60K GATES 100-VQFP
标准包装: 90
系列: ProASIC3 nano
RAM 位总计: 18432
输入/输出数: 71
门数: 60000
电源电压: 1.425 V ~ 1.575 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 100-TQFP
供应商设备封装: 100-VQFP(14x14)
ProASIC3 nano Device Overview
1-4
Revision 11
The FPGA core consists of a sea of VersaTiles. Each VersaTile can be configured as a three-input logic
function, a D-flip-flop (with or without enable), or a latch by programming the appropriate flash switch
interconnections. The versatility of the ProASIC3 nano core tile as either a three-input lookup table (LUT)
equivalent or as a D-flip-flop/latch with enable allows for efficient use of the FPGA fabric. The VersaTile
capability is unique to the ProASIC3 family of third-generation architecture flash FPGAs. VersaTiles are
connected with any of the four levels of routing hierarchy. Flash switches are distributed throughout the
device to provide nonvolatile, reconfigurable interconnect programming. Maximum core utilization is
possible for virtually any design.
Figure 1-3 ProASIC3 nano Device Architecture Overview with Two I/O Banks (A3PN060 and A3PN125)
Figure 1-4 ProASIC3 nano Device Architecture Overview with Four I/O Banks (A3PN250)
RAM Block
4,608-Bit Dual-Port
SRAM or FIFO Block
VersaTile
CCC
I/Os
ISP AES
Decryption
User Nonvolatile
FlashROM
Charge Pumps
Bank 0
Bank
1
Bank
1
Bank
0
Bank
0
Bank 1
RAM Block
4,608-Bit Dual-Port
SRAM or FIFO Block
VersaTile
CCC
I/Os
ISP AES
Decryption
User Nonvolatile
FlashROM
Charge Pumps
Bank 0
Bank
3
Bank
3
Bank
1
Bank
1
Bank 2
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相关代理商/技术参数
参数描述
A3PN060-2VQG100 功能描述:IC FPGA NANO 60K GATES 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
A3PN060-2VQG100I 功能描述:IC FPGA NANO 60K GATES 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
A3PN060-DIELOT 制造商:Microsemi Corporation 功能描述:A3PN060-DIELOT - Gel-pak, waffle pack, wafer, diced wafer on film
A3PN060-VQ100 功能描述:IC FPGA NANO 60K GATES 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
A3PN060-VQ100I 功能描述:IC FPGA NANO 60K GATES 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)