参数资料
型号: A40MX02-1PL68
厂商: Microsemi SoC
文件页数: 65/142页
文件大小: 0K
描述: IC FPGA MX SGL CHIP 3K 68-PLCC
标准包装: 19
系列: MX
输入/输出数: 57
门数: 3000
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 68-LCC(J 形引线)
供应商设备封装: 68-PLCC(24.23x24.23)
40MX and 42MX FPGA Families
Re vi s i on 11
1 - 25
Junction Temperature (TJ)
The temperature variable in the Designer software refers to the junction temperature, not the ambient
temperature. This is an important distinction because the heat generated from dynamic power
consumption is usually hotter than the ambient temperature. EQ , shown below, can be used to calculate
junction temperature.
Junction Temperature =
ΔT + T
a (1)
EQ 1
Where:
Ta = Ambient Temperature
ΔT = Temperature gradient between junction (silicon) and ambient
ΔT = θ
ja * P (2)
P = Power
θ
ja = Junction to ambient of package. θja numbers are located in Table 1-21 on page 1-26.
Figure 1-15 Typical Output Drive Characteristics (Based Upon Measured Data)
0
1
23
45
6
MX PCI IOL
MX PCI IOH
PCI IOL Maximum
PCI IOL Minimum
PCI IOH Minimum
PCI IOH Maximum
Voltage Out (V)
–0.20
–0.15
–0.10
–0.05
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
Current
(A)
相关PDF资料
PDF描述
A40MX02-1PLG68 IC FPGA MX SGL CHIP 3K 68-PLCC
GSA50DTBT-S273 CONN EDGECARD 100PS R/A .125 SLD
GMA50DTBT-S273 CONN EDGECARD 100PS R/A .125 SLD
GSA50DTAT-S273 CONN EDGECARD 100PS R/A .125 SLD
GMA50DTAT-S273 CONN EDGECARD 100PS R/A .125 SLD
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