参数资料
型号: A40MX02-2PL44
厂商: Microsemi SoC
文件页数: 13/142页
文件大小: 0K
描述: IC FPGA MX SGL CHIP 3K 44-PLCC
标准包装: 27
系列: MX
输入/输出数: 34
门数: 3000
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 44-LCC(J 形引线)
供应商设备封装: 44-PLCC(16.59x16.59)
40MX and 42MX FPGA Families
Re vi s i on 11
1-7
MultiPlex I/O Modules
42MX devices feature Multiplex I/Os and support 5.0V, 3.3V, and mixed 3.3V/5.0V operations.
The MultiPlex I/O modules provide the interface between the device pins and the logic array. Figure 1-9
is a block diagram of the 42MX I/O module. A variety of user functions, determined by a library macro
selection, can be implemented in the module. (Refer to the Antifuse Macro Library Guide for more
information.) All 42MX I/O modules contain tristate buffers, with input and output latches that can be
configured for input, output, or bidirectional operation.
All 42MX devices contain flexible I/O structures, where each output pin has a dedicated output-enable
control (Figure 1-9). The I/O module can be used to latch input or output data, or both, providing fast set-
up time. In addition, the Designer software tools can build a D-type flip-flop using a C-module combined
with an I/O module to register input and output signals. Refer to the Antifuse Macro Library Guide for
more details.
A42MX24 and A42MX36 devices also offer selectable PCI output drives, enabling 100% compliance with
version 2.1 of the PCI specification. For low-power systems, all inputs and outputs are turned off to
reduce current consumption to below 500
μA.
To achieve 5.0V or 3.3V PCI-compliant output drives on A42MX24 and A42MX36 devices, a chip-wide
PCI fuse is programmed via the Device Selection Wizard in the Designer software (Figure 1-10). When
the PCI fuse is not programmed, the output drive is standard.
Designer software development tools provide a design library of I/O macro functions that can implement
all I/O configurations supported by the MX FPGAs.
Note:
*Can be configured as a Latch or D Flip-Flop (Using
C-Module)
Figure 1-9
42MX I/O Module
Figure 1-10 PCI Output Structure of A42MX24 and A42MX36 Devices
Q
D
From Array
To Array
G/CLK*
Q
D
PAD
EN
Signal
PCI Enable
PCI
Fuse
Drive
STD
Output
相关PDF资料
PDF描述
HMM44DRYN CONN EDGECARD 88POS DIP .156 SLD
HSM44DRYH CONN EDGECARD 88POS DIP .156 SLD
HMM44DRYH CONN EDGECARD 88POS DIP .156 SLD
AMM25DRKF CONN EDGECARD 50POS DIP .156 SLD
RMC50DRTI-S93 CONN EDGECARD 100PS DIP .100 SLD
相关代理商/技术参数
参数描述
A40MX02-2PL44I 功能描述:IC FPGA MX SGL CHIP 3K 44-PLCC RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A40MX02-2PL44M 制造商:未知厂家 制造商全称:未知厂家 功能描述:Field Programmable Gate Array (FPGA)
A40MX02-2PL68 功能描述:IC FPGA MX SGL CHIP 3K 68-PLCC RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A40MX02-2PL68I 功能描述:IC FPGA MX SGL CHIP 3K 68-PLCC RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A40MX02-2PL68M 制造商:未知厂家 制造商全称:未知厂家 功能描述:Field Programmable Gate Array (FPGA)