参数资料
型号: A40MX02-2VQG80I
厂商: Microsemi SoC
文件页数: 112/142页
文件大小: 0K
描述: IC FPGA MX SGL CHIP 3K 80-VQFP
标准包装: 90
系列: MX
输入/输出数: 57
门数: 3000
电源电压: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 80-TQFP
供应商设备封装: 80-VQFP(14x14)
40MX and 42MX FPGA Families
Re vi s i on 11
1 - 67
Table 1-36 A42MX24 Timing Characteristics (Nominal 5.0 V Operation)
(Worst-Case Commercial Conditions, VCCA = 4.75 V, TJ = 70°C)
–3 Speed
–2 Speed
–1 Speed
Std Speed
–F Speed
Parameter / Description
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units
Logic Module Combinatorial Functions1
tPD
Internal Array Module Delay
1.2
1.3
1.5
1.8
2.5
ns
tPDD
Internal Decode Module Delay
1.4
1.6
1.8
2.1
3.0
ns
Logic Module Predicted Routing Delays2
tRD1
FO = 1 Routing Delay
0.8
0.9
1.0
1.2
1.7
ns
tRD2
FO = 2 Routing Delay
1.0
1.2
1.3
1.5
2.1
ns
tRD3
FO = 3 Routing Delay
1.3
1.4
1.6
1.9
2.6
ns
tRD4
FO = 4 Routing Delay
1.5
1.7
1.9
2.2
3.1
ns
tRD5
FO = 8 Routing Delay
2.4
2.7
3.0
3.6
5.0
ns
Logic Module Sequential Timing3, 4
tCO
Flip-Flop Clock-to-Output
1.3
1.4
1.6
1.9
2.7
ns
tGO
Latch Gate-to-Output
1.2
1.3
1.5
1.8
2.5
ns
tSUD
Flip-Flop (Latch) Set-Up Time
0.3
0.4
0.5
0.7
ns
tHD
Flip-Flop (Latch) Hold Time
0.0
ns
tRO
Flip-Flop (Latch) Reset-to-Output
1.4
1.6
1.8
2.1
2.9
ns
tSUENA
Flip-Flop (Latch) Enable Set-Up
0.4
0.5
0.6
0.8
ns
tHENA
Flip-Flop (Latch) Enable Hold
0.0
ns
tWCLKA
Flip-Flop (Latch)
Clock Active Pulse Width
3.3
3.7
4.2
4.9
6.9
ns
tWASYN
Flip-Flop (Latch)
Asynchronous Pulse Width
4.4
4.8
5.3
6.5
9.0
ns
Input Module Propagation Delays
tINPY
Input Data Pad-to-Y
1.0
1.1
1.3
1.5
2.1
ns
tINGO
Input Latch Gate-to-Output
1.3
1.4
1.6
1.9
2.6
ns
tINH
Input Latch Hold
0.0
ns
tINSU
Input Latch Set-Up
0.5
0.6
0.7
1.0
ns
tILA
Latch Active Pulse Width
4.7
5.2
5.9
6.9
9.7
ns
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
can be obtained from the Timer utility.
4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input.
External setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an
external PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
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