参数资料
型号: A40MX04-1VQ80
厂商: Microsemi SoC
文件页数: 57/142页
文件大小: 0K
描述: IC FPGA MX SGL CHIP 6K 80-VQFP
标准包装: 90
系列: MX
输入/输出数: 69
门数: 6000
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 80-TQFP
供应商设备封装: 80-VQFP(14x14)
40MX and 42MX FPGA Families
Re vi s i on 11
1 - 17
tSTG
Storage Temperature
–65 to +150
°C
Note:
*Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Devices
should not be operated outside the Recommended Operating Conditions.
Table 1-7
Absolute Maximum Ratings for 42MX Devices*
Symbol
Parameter
Limits
Units
VCCI
DC Supply Voltage for I/Os
–0.5 to +7.0
V
VCCA
DC Supply Voltage for Array
–0.5 to +7.0
V
VI
Input Voltage
–0.5 to VCCI+0.5
V
VO
Output Voltage
–0.5 to VCCI+0.5
V
tSTG
Storage Temperature
–65 to +150
°C
Note:
*Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Devices
should not be operated outside the Recommended Operating Conditions.
Table 1-8
Recommended Operating Conditions
Parameter
Commercial
Industrial
Military
Units
Temperature Range*
0 to +70
–40 to +85
–55 to +125
°C
VCC (40MX)
4.75 to 5.25
4.5 to 5.5
V
VCCA (42MX)
4.75 to 5.25
4.5 to 5.5
V
VCCI (42MX)
4.75 to 5.25
4.5 to 5.5
V
Note:
*Ambient temperature (TA) is used for commercial and industrial grades; case temperature (TC) is used for
military grades.
Table 1-6
Absolute Maximum Ratings for 40MX Devices*
Symbol
Parameter
Limits
Units
相关PDF资料
PDF描述
EPF6016ATC144-1N IC FLEX 6000 FPGA 16K 144-TQFP
EPF6016ATC144-1 IC FLEX 6000 FPGA 16K 144-TQFP
AGM31DTBN-S189 CONN EDGECARD 62POS R/A .156 SLD
A40MX04-1VQG80 IC FPGA MX SGL CHIP 6K 80-VQFP
A40MX04-VQG80I IC FPGA MX SGL CHIP 6K 80-VQFP
相关代理商/技术参数
参数描述
A40MX04-1VQ80I 功能描述:IC FPGA MX SGL CHIP 6K 80-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A40MX04-1VQ80M 制造商:Microsemi Corporation 功能描述:FPGA 6K GATES 547 CELLS 96MHZ/160MHZ 0.45UM 3.3V/5V 80VQFP - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 69 I/O 80VQFP 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 6K 80-VQFP
A40MX04-1VQG80 功能描述:IC FPGA MX SGL CHIP 6K 80-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A40MX04-1VQG80I 功能描述:IC FPGA MX SGL CHIP 6K 80-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A40MX04-1VQG80M 制造商:Microsemi Corporation 功能描述:FPGA 6K GATES 547 CELLS 96MHZ/160MHZ 0.45UM 3.3V/5V 80VQFP - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 69 I/O 80VQFP