参数资料
型号: A42MX09-PQ160A
厂商: Microsemi SoC
文件页数: 120/142页
文件大小: 0K
描述: IC FPGA MX SGL CHIP 14K 160-PQFP
标准包装: 24
系列: MX
输入/输出数: 101
门数: 14000
电源电压: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
安装类型: 表面贴装
工作温度: -40°C ~ 125°C
封装/外壳: 160-BQFP
供应商设备封装: 160-PQFP(28x28)
40MX and 42MX FPGA Families
Re vi s i on 11
1 - 75
tRENSU
Read Enable Set-Up
0.6
0.7
0.8
0.9
1.3
ns
tRENH
Read Enable Hold
3.4
3.8
4.3
5.0
7.0
ns
tWENSU
Write Enable Set-Up
2.7
3.0
3.4
4.0
5.6
ns
tWENH
Write Enable Hold
0.0
ns
tBENS
Block Enable Set-Up
2.8
3.1
3.5
4.1
5.7
ns
tBENH
Block Enable Hold
0.0
ns
Asynchronous SRAM Operations
tRPD
Asynchronous Access Time
8.1
9.0
10.2
12.0
16.8
ns
tRDADV
Read Address Valid
8.8
9.8
11.1
13.0
18.2
ns
tADSU
Address/Data Set-Up Time
1.6
1.8
2.0
2.4
3.4
ns
tADH
Address/Data Hold Time
0.0
ns
tRENSUA Read Enable Set-Up to Address
Valid
0.6
0.7
0.8
0.9
1.3
ns
tRENHA
Read Enable Hold
3.4
3.8
4.3
5.0
7.0
ns
tWENSU
Write Enable Set-Up
2.7
3.0
3.4
4.0
5.6
ns
tWENH
Write Enable Hold
0.0
ns
tDOH
Data Out Hold Time
1.2
1.3
1.5
1.8
2.5
ns
Input Module Propagation Delays
tINPY
Input Data Pad-to-Y
1.0
1.1
1.3
1.5
2.1
ns
tINGO
Input Latch Gate-to-Output
1.4
1.6
1.8
2.1
2.9
ns
tINH
Input Latch Hold
0.0
ns
tINSU
Input Latch Set-Up
0.5
0.6
0.7
1.0
ns
tILA
Latch Active Pulse Width
4.7
5.2
5.9
6.9
9.7
ns
Input Module Predicted Routing Delays2
tIRD1
FO = 1 Routing Delay
2.0
2.2
2.5
2.9
4.1
ns
tIRD2
FO = 2 Routing Delay
2.3
2.6
2.9
3.4
4.8
ns
tIRD3
FO = 3 Routing Delay
2.6
2.9
3.3
3.9
5.5
ns
tIRD4
FO = 4 Routing Delay
3.0
3.3
3.8
4.4
6.2
ns
tIRD8
FO = 8 Routing Delay
4.3
4.8
5.5
6.4
9.0
ns
Table 1-38 A42MX36 Timing Characteristics (Nominal 5.0 V Operation)
(Worst-Case Commercial Conditions, VCCA = 4.75 V, TJ = 70°C)
–3 Speed
–2 Speed
–1 Speed
Std Speed
–F Speed
Parameter / Description
Min. Max. Min. Max. Min. Max. Min. Max. Min.
Max. Units
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
can be obtained from the Timer utility.
4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input.
External setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an
external PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
相关PDF资料
PDF描述
A54SX16P-VQG100 IC FPGA SX 24K GATES 100-VQFP
ABC49DREI-S13 CONN EDGECARD 98POS .100 EYELET
IDT70V25L25PFGI IC SRAM 128KBIT 25NS 100TQFP
ACB75DHFT CONN EDGECARD 150POS .050 SMD
ABB75DHFT CONN EDGECARD 150POS .050 SMD
相关代理商/技术参数
参数描述
A42MX09-PQ160I 功能描述:IC FPGA MX SGL CHIP 14K 160-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A42MX09-PQ160M 制造商:Microsemi Corporation 功能描述:FPGA 42MX Family 14K Gates 336 Cells 129MHz/215MHz 0.45um Technology 3.3V/5V 160-Pin PQFP 制造商:Microsemi Corporation 功能描述:FPGA 14K GATES 336 CELLS 129MHZ/215MHZ 0.45UM 3.3V/5V 160PQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 14K 160-PQFP
A42MX09-PQ208A 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:40MX and 42MX Automotive FPGA Families
A42MX09-PQG100 功能描述:IC FPGA 104I/O 100PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP(28x28)
A42MX09-PQG100A 功能描述:IC FPGA MX SGL CHIP 14K 100-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)