参数资料
型号: A42MX09-TQ176
厂商: Microsemi SoC
文件页数: 45/142页
文件大小: 0K
描述: IC FPGA MX SGL CHIP 14K 176-TQFP
标准包装: 40
系列: MX
输入/输出数: 104
门数: 14000
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 176-LQFP
供应商设备封装: 176-TQFP(24x24)
Re vi s i on 11
3-1
3 – Datasheet Information
List of Changes
The following table lists critical changes that were made in the current version of the document.
Revision
Changes
Page
Revision 11
(May 2012)
The FuseLock logo and accompanying text was removed from the "User Security"
section. This marking is no longer used on Microsemi devices (PCN 0915).
The "Development Tool Support" section was updated (SAR 38512).
Revision 10
(April 2012)
"Ordering Information" was updated to include lead-free package ordering codes
(SAR 21968).
The "User Security" section was revised to clarify that although no existing security
measures can give an absolute guarantee, Microsemi FPGAs implement the best
security available in the industry (SAR 34673).
The "Transient Current" section is new (SAR 36930).
Package names were revised according to standards established in Package
Revision 9
(v6.1, April 2009)
In Table 1-14 Absolute Maximum Ratings*, the limits in VI were changed from -0.5 to
VCCI + 0.5 to -0.5 to VCCA + 0.5.
to 2.4 for the min in industrial and military. VIH had VCCI and that was changed to
VCCA.
v6.0
(January 2004)
The "User Security" section was updated.
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相关代理商/技术参数
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A42MX09-TQ176A 功能描述:IC FPGA MX SGL CHIP 14K 176-TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A42MX09-TQ176I 功能描述:IC FPGA MX SGL CHIP 14K 176-TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A42MX09-TQ176M 制造商:Microsemi Corporation 功能描述:FPGA 14K GATES 336 CELLS 129MHZ/215MHZ 0.45UM 3.3V/5V 176TQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 14K 176-TQFP 制造商:Microsemi Corporation 功能描述:IC FPGA 104 I/O 176TQFP
A42MX09-TQ208A 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:40MX and 42MX Automotive FPGA Families
A42MX09-TQG176 功能描述:IC FPGA 104I/O 176TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:60 系列:XP LAB/CLB数:- 逻辑元件/单元数:10000 RAM 位总计:221184 输入/输出数:244 门数:- 电源电压:1.71 V ~ 3.465 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:388-BBGA 供应商设备封装:388-FPBGA(23x23) 其它名称:220-1241