参数资料
型号: A42MX09-VQ100
元件分类: FPGA
英文描述: FPGA, 336 CLBS, 14000 GATES, 117 MHz, PQFP100
封装: 1 MM HEIGHT, PLASTIC, VQFP-100
文件页数: 100/124页
文件大小: 3142K
代理商: A42MX09-VQ100
40MX and 42MX FPGA Families
v6.1
1-71
Input Module Predicted Routing Delays2
tIRD1
FO=1 Routing Delay
2.0
2.2
2.5
2.9
4.1
ns
tIRD2
FO=2 Routing Delay
2.3
2.6
2.9
3.4
4.8
ns
tIRD3
FO=3 Routing Delay
2.6
2.9
3.3
3.9
5.5
ns
tIRD4
FO=4 Routing Delay
3.0
3.3
3.8
4.4
6.2
ns
tIRD8
FO=8 Routing Delay
4.3
4.8
5.5
6.4
9.0
ns
Global Clock Network
tCKH
Input LOW to HIGH
FO=32
FO=635
2.7
3.0
3.3
3.4
3.8
4.0
4.4
5.6
6.2
ns
tCKL
Input HIGH to LOW
FO=32
FO=635
3.8
4.9
4.2
5.4
4.8
6.1
5.6
7.2
7.8
10.1
ns
tPWH
Minimum Pulse
Width HIGH
FO=32
FO=635
1.8
2.0
2.2
2.5
2.6
2.9
3.6
4.1
ns
tPWL
Minimum Pulse
Width LOW
FO=32
FO=635
1.8
2.0
2.2
2.5
2.6
2.9
3.6
4.1
ns
tCKSW
Maximum Skew
FO=32
FO=635
0.8
0.9
1.0
1.4
ns
tSUEXT
Input Latch External
Set-Up
FO=32
FO=635
0.0
ns
tHEXT
Input Latch External
Hold
FO=32
FO=635
2.8
3.3
3.2
3.7
3.6
4.2
4.9
5.9
6.9
ns
tP
Minimum Period
(1/fMAX)
FO=32
FO=635
5.5
6.0
6.1
6.6
7.2
7.6
8.3
12.7
13.8
ns
fMAX
Maximum Datapath
Frequency
FO=32
FO=635
180
166
164
151
139
131
121
79
73
MHz
TTL Output Module Timing5
tDLH
Data-to-Pad HIGH
2.6
2.8
3.2
3.8
5.3
ns
tDHL
Data-to-Pad LOW
3.0
3.3
3.7
4.4
6.2
ns
tENZH
Enable Pad Z to HIGH
2.7
3.0
3.3
3.9
5.5
ns
tENZL
Enable Pad Z to LOW
3.0
3.3
3.7
4.3
6.1
ns
tENHZ
Enable Pad HIGH to Z
5.3
5.8
6.6
7.8
10.9
ns
Table 38
A42MX36 Timing Characteristics (Nominal 5.0V Operation)
(Worst-Case Commercial Conditions, VCCA = 4.75V, TJ = 70°C)
‘–3’ Speed
‘–2’ Speed
‘–1’ Speed
‘Std’ Speed
‘–F’ Speed
Parameter Description
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max. Units
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating
device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be
obtained from the Timer utility.
4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input. External setup/
hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to
the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
相关PDF资料
PDF描述
AFS250-FFG256 FPGA, 250000 GATES, PBGA256
AFS250-FFGG256 FPGA, 250000 GATES, PBGA256
AFS250-FPQ208 FPGA, 250000 GATES, PQFP208
AFS250-FPQG208 FPGA, 250000 GATES, PQFP208
AFS250-FQN180 FPGA, 250000 GATES, PBCC180
相关代理商/技术参数
参数描述
A42MX09-VQ100A 功能描述:IC FPGA MX SGL CHIP 14K 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A42MX09-VQ100I 功能描述:IC FPGA MX SGL CHIP 14K 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A42MX09-VQ100M 制造商:Microsemi Corporation 功能描述:FPGA 42MX Family 14K Gates 336 Cells 129MHz/215MHz 0.45um Technology 3.3V/5V 100-Pin VQFP 制造商:Microsemi Corporation 功能描述:FPGA 14K GATES 336 CELLS 129MHZ/215MHZ 0.45UM 3.3V/5V 100VQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 14K 100-VQFP 制造商:Microsemi Corporation 功能描述:IC FPGA 83 I/O 100VQFP
A42MX09-VQ208A 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:40MX and 42MX Automotive FPGA Families
A42MX09-VQG100 功能描述:IC FPGA 104I/O 100VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP(28x28)