参数资料
型号: A42MX09-VQ100
元件分类: FPGA
英文描述: FPGA, 336 CLBS, 14000 GATES, 117 MHz, PQFP100
封装: 1 MM HEIGHT, PLASTIC, VQFP-100
文件页数: 43/124页
文件大小: 3142K
代理商: A42MX09-VQ100
40MX and 42MX FPGA Families
v6.1
1-19
Output Drive Characteristics for 5.0V PCI Signaling
MX PCI device I/O drivers were designed specifically for high-performance PCI systems. Figure 1-16 on page 1-21 shows
the typical output drive characteristics of the MX devices. MX output drivers are compliant with the PCI Local Bus
Specification.
Table 17
DC Specification (5.0V PCI Signaling)1
PCI
MX
Symbol
Parameter
Condition
Min.
Max.
Min.
Max.
Units
VCCI
Supply Voltage for I/Os
4.75
5.25
4.75
5.252
V
VIH
Input High Voltage
2.0
VCC + 0.5
2.0
VCCI + 0.3
V
VIL
Input Low Voltage
–0.5
0.8
–0.3
0.8
V
IIH
Input High Leakage Current
VIN = 2.7V
70
10
A
IIL
Input Low Leakage Current
VIN=0.5V
–70
–10
A
VOH
Output High Voltage
IOUT = –2 mA
IOUT = –6 mA
2.4
3.84
V
VOL
Output Low Voltage
IOUT = 3 mA,
6 mA
0.55
0.33
V
CIN
Input Pin Capacitance
10
10
pF
CCLK
CLK Pin Capacitance
5
12
10
pF
LPIN
Pin Inductance
20
< 8 nH3
nH
Notes:
1. PCI Local Bus Specification, Version 2.1, Section 4.2.1.1.
2. Maximum rating for VCCI –0.5V to 7.0V.
3. Dependent upon the chosen package. PCI recommends QFP and BGA packaging to reduce pin inductance and capacitance.
Table 18
AC Specifications (5.0V PCI Signaling)*
PCI
MX
Symbol
Parameter
Condition
Min.
Max.
Min.
Max.
Units
ICL
Low Clamp Current
–5 < VIN –1
–25 + (VIN +1)
/0.015
–60
–10
mA
Slew (r)
Output Rise Slew Rate
0.4V to 2.4V load
1
5
1.8
2.8
V/ns
Slew (f)
Output Fall Slew Rate
2.4V to 0.4V load
1
5
2.8
4.3
V/ns
Note: *PCI Local Bus Specification, Version 2.1, Section 4.2.1.2.
相关PDF资料
PDF描述
AFS250-FFG256 FPGA, 250000 GATES, PBGA256
AFS250-FFGG256 FPGA, 250000 GATES, PBGA256
AFS250-FPQ208 FPGA, 250000 GATES, PQFP208
AFS250-FPQG208 FPGA, 250000 GATES, PQFP208
AFS250-FQN180 FPGA, 250000 GATES, PBCC180
相关代理商/技术参数
参数描述
A42MX09-VQ100A 功能描述:IC FPGA MX SGL CHIP 14K 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A42MX09-VQ100I 功能描述:IC FPGA MX SGL CHIP 14K 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A42MX09-VQ100M 制造商:Microsemi Corporation 功能描述:FPGA 42MX Family 14K Gates 336 Cells 129MHz/215MHz 0.45um Technology 3.3V/5V 100-Pin VQFP 制造商:Microsemi Corporation 功能描述:FPGA 14K GATES 336 CELLS 129MHZ/215MHZ 0.45UM 3.3V/5V 100VQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 14K 100-VQFP 制造商:Microsemi Corporation 功能描述:IC FPGA 83 I/O 100VQFP
A42MX09-VQ208A 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:40MX and 42MX Automotive FPGA Families
A42MX09-VQG100 功能描述:IC FPGA 104I/O 100VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP(28x28)