参数资料
| 型号： | A42MX16-PQG208I |
| 厂商： | Microsemi SoC |
| 文件页数： | 24/142页 |
| 文件大小： | 0K |
| 描述： | IC FPGA MX SGL CHIP 24K 208-PQFP |
| 标准包装： | 24 |
| 系列： | MX |
| 输入/输出数： | 140 |
| 门数： | 24000 |
| 电源电压： | 3 V ~ 3.6 V，4.5 V ~ 5.5 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 208-BFQFP |
| 供应商设备封装： | 208-PQFP（28x28） |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页当前第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页第117页第118页第119页第120页第121页第122页第123页第124页第125页第126页第127页第128页第129页第130页第131页第132页第133页第134页第135页第136页第137页第138页第139页第140页第141页第142页
40MX and 42MX FPGA Families
1- 8
R ev isio n 1 1
Other Architectural Features
Performance
MX devices can operate with internal clock frequencies of 250 MHz, enabling fast execution of complex
logic functions. MX devices are live on power-up and do not require auxiliary configuration devices and
thus are an optimal platform to integrate the functionality contained in multiple programmable logic
devices. In addition, designs that previously would have required a gate array to meet performance can
be integrated into an MX device with improvements in cost and time-to-market. Using timing-driven
place-and-route (TDPR) tools, designers can achieve highly deterministic device performance.
User Security
Microsemi FuseLock provides robust security against design theft. Special security fuses are hidden in
the fabric of the device and protect against unauthorized users attempting to access the programming
and/or probe interfaces. It is virtually impossible to identify or bypass these fuses without damaging the
device, making Microsemi antifuse FPGAs protected with the highest level of security available from both
invasive and noninvasive attacks.
Special security fuses in 40MX devices include the Probe Fuse and Program Fuse. The former disables
the probing circuitry while the latter prohibits further programming of all fuses, including the Probe Fuse.
In 42MX devices, there is the Security Fuse which, when programmed, both disables the probing circuitry
and prohibits further programming of the device.
Programming
Device programming is supported through the Silicon Sculptor series of programmers. Silicon Sculptor II
is a compact, robust, single-site and multi-site device programmer for the PC. With standalone software,
Silicon Sculptor II is designed to allow concurrent programming of multiple units from the same PC.
Silicon Sculptor II programs devices independently to achieve the fastest programming times possible.
After being programmed, each fuse is verified to insure that it has been programmed correctly.
Furthermore, at the end of programming, there are integrity tests that are run to ensure no extra fuses
have been programmed. Not only does it test fuses (both programmed and nonprogrammed), Silicon
Sculptor II also allows self-test to verify its own hardware extensively.
The procedure for programming an MX device using Silicon Sculptor II is as follows:
1. Load the *.AFM file
2. Select the device to be programmed
3. Begin programming
When the design is ready to go to production, Microsemi offers device volume-programming services
either through distribution partners or via In-House Programming from the factory.
For more details on programming MX devices, please refer to the Programming Antifuse Devices and the
Silicon Sculptor II user's guides.
相关PDF资料 |
PDF描述 |
|---|---|
| A42MX16-2PQ100 | IC FPGA MX SGL CHIP 24K 100-PQFP |
| A1020B-PQ100C | IC FPGA 2K GATES 100-PQFP COM |
| 5745653-5 | CONN BACKSHELL DB25 90DEG METAL |
| A1020B-PQG100C | IC FPGA 2K GATES 100-PQFP COM |
| 5745653-4 | CONN BACKSHELL DB25 90DEG METAL |
相关代理商/技术参数 |
参数描述 |
|---|---|
| A42MX16-PQG208M | 制造商:Microsemi Corporation 功能描述:FPGA 24K GATES 608 CELLS 103MHZ/172MHZ 0.45UM 3.3V/5V 208PQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 140 I/O 208PQFP |
| A42MX16-TQ176 | 功能描述:IC FPGA MX SGL CHIP 24K 176-TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A42MX16-TQ176A | 功能描述:IC FPGA MX SGL CHIP 24K 176-TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A42MX16-TQ176I | 功能描述:IC FPGA MX SGL CHIP 24K 176-TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A42MX16-TQ176M | 制造商:Microsemi Corporation 功能描述:FPGA 24K GATES 608 CELLS 103MHZ/172MHZ 0.45UM 3.3V/5V 176TQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 24K 176-TQFP 制造商:Microsemi Corporation 功能描述:IC FPGA 140 I/O 176TQFP |
发布紧急采购，3分钟左右您将得到回复。