参数资料
型号: A42MX24-3PQG208
厂商: Microsemi SoC
文件页数: 121/142页
文件大小: 0K
描述: IC FPGA MX SGL CHIP 36K 208-PQFP
标准包装: 24
系列: MX
输入/输出数: 176
门数: 36000
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 208-BFQFP
供应商设备封装: 208-PQFP(28x28)
40MX and 42MX FPGA Families
1- 4
R ev isio n 1 1
provides capability to quickly design memory functions with the SRAM blocks. Unused SRAM blocks can
be used to implement registers for other user logic within the design.
Routing Structure
The MX architecture uses vertical and horizontal routing tracks to interconnect the various logic and I/O
modules. These routing tracks are metal interconnects that may be continuous or split into segments.
Varying segment lengths allow the interconnect of over 90% of design tracks to occur with only two
antifuse connections. Segments can be joined together at the ends using antifuses to increase their
lengths up to the full length of the track. All interconnects can be accomplished with a maximum of four
antifuses.
Horizontal Routing
Horizontal routing tracks span the whole row length or are divided into multiple segments and are located
in between the rows of modules. Any segment that spans more than one-third of the row length is
considered a long horizontal segment. A typical channel is shown in Figure 1-6. Within horizontal routing,
dedicated routing tracks are used for global clock networks and for power and ground tie-off tracks. Non-
dedicated tracks are used for signal nets.
Vertical Routing
Another set of routing tracks run vertically through the module. There are three types of vertical tracks:
input, output, and long. Long tracks span the column length of the module, and can be divided into
multiple segments. Each segment in an input track is dedicated to the input of a particular module; each
segment in an output track is dedicated to the output of a particular module. Long segments are
Figure 1-4
A42MX24 and A42MX36 D-Module Implementation
Figure 1-5
A42MX36 Dual-Port SRAM Block
7 Inputs
Hard-Wire to I/O
Feedback to Array
Programmable
Inverter
SRAM Module
32 x 8 or 64 x 4
(256 Bits)
Read
Port
Logic
Write
Port
Logic
RD[7:0]
Routing Tracks
Latches
Read
Logic
[5:0]
RDAD[5:0]
REN
RCLK
Latches
WD[7:0]
Latches
WRAD[5:0]
Write
Logic
MODE
BLKEN
WEN
WCLK
[5:0]
[7:0]
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A42MX24-3PQG208I 功能描述:IC FPGA MX SGL CHIP 36K 208-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A42MX24-3TQ176 功能描述:IC FPGA MX SGL CHIP 36K 176-TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A42MX24-3TQ176I 功能描述:IC FPGA MX SGL CHIP 36K 176-TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A42MX24-3TQG176 功能描述:IC FPGA MX SGL CHIP 36K 176-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
A42MX24-3TQG176I 功能描述:IC FPGA MX SGL CHIP 36K 176-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)