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| 型号： | A42MX24-3VQ100 |
| 厂商： | Electronic Theatre Controls, Inc. |
| 英文描述： | 40MX and 42MX FPGA Families |
| 中文描述： | 40MX和42MX FPGA系列 |
| 文件页数： | 9/93页 |
| 文件大小： | 854K |
| 代理商： | A42MX24-3VQ100 |
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40MX and 42MX FPGA Families
v6.0
1-11
Each I/O cell has three boundary-scan register cells, each
with a serial-in, serial-out, parallel-in, and parallel-out
pin. The serial pins are used to serially connect all the
boundary-scan register cells in a device into a boundary-
scan register chain, which starts at the TDI pin and ends
at the TDO pin. The parallel ports are connected to the
internal core logic tile and the input, output and control
ports of an I/O buffer to capture and load data into the
register to control or observe the logic state of each I/O.
Figure 1-14 42MX IEEE 1149.1 Boundary Scan Circuitry
Table 3
Test Access Port Descriptions
Port
Description
TMS
(Test
Mode
Select)
Serial input for the test logic control bits. Data is captured on the rising edge of the test logic clock (TCK).
TCK (Test Clock Input) Dedicated test logic clock used serially to shift test instruction, test data, and control inputs on the rising edge
of the clock, and serially to shift the output data on the falling edge of the clock. The maximum clock frequency
for TCK is 20 MHz.
TDI (Test Data Input)
Serial input for instruction and test data. Data is captured on the rising edge of the test logic clock.
TDO
(Test
Data
Output)
Serial output for test instruction and data from the test logic. TDO is set to an Inactive Drive state (high
impedance) when data scanning is not in progress.
Table 4
Supported BST Public Instructions
Instruction
IR Code (IR2.IR0)
Instruction Type
Description
EXTEST
000
Mandatory
Allows the external circuitry and board-level interconnections to
be tested by forcing a test pattern at the output pins and
capturing test results at the input pins.
SAMPLE/PRELOAD
001
Mandatory
Allows a snapshot of the signals at the device pins to be
captured and examined during operation
HIGH Z
101
Optional
Tristates all I/Os to allow external signals to drive pins. Please
refer to the IEEE Standard 1149.1 specification.
CLAMP
110
Optional
Allows state of signals driven from component pins to be
determined from the Boundary-Scan Register. Please refer to
the IEEE Standard 1149.1 specification for details.
BYPASS
111
Mandatory
Enables the bypass register between the TDI and TDO pins. The
test data passes through the selected device to adjacent devices
in the test chain.
Boundary Scan Register
Instruction
Decode
Control Logic
TAP Controller
Instruction
Register
Bypass
Register
TMS
TCK
TDI
Output
MUX
TDO
JTAG
相关PDF资料 |
PDF描述 |
|---|---|
| A42MX24-3VQ100A | 40MX and 42MX FPGA Families |
| A42MX24-3VQ100B | 40MX and 42MX FPGA Families |
| A42MX36-2PQ100B | 40MX and 42MX FPGA Families |
| A42MX36-2PQ100ES | 40MX and 42MX FPGA Families |
| A42MX36-2TQ100 | 40MX and 42MX FPGA Families |
相关代理商/技术参数 |
参数描述 |
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| A42MX24-FPQ160 | 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A42MX24-FPQ208 | 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A42MX24-FPQG160 | 功能描述:IC FPGA MX SGL CHIP 36K 160-PQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:MX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
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