参数资料
型号: A42MX36-1BGG272
厂商: Microsemi SoC
文件页数: 54/142页
文件大小: 0K
描述: IC FPGA MX SGL CHIP 54K 272-PBGA
标准包装: 40
系列: MX
RAM 位总计: 2560
输入/输出数: 202
门数: 54000
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 272-BBGA
供应商设备封装: 272-PBGA(27x27)
40MX and 42MX FPGA Families
Re vi s i on 11
1 - 15
JTAG Mode Activation
The JTAG test logic circuit is activated in the Designer software by selecting Tools -> Device Selection.
This brings up the Device Selection dialog box as shown in Figure 1-14. The JTAG test logic circuit can
be enabled by clicking the "Reserve JTAG Pins" check box. Table 1-5 explains the pins' behavior in
either mode.
TRST Pin and TAP Controller Reset
An active reset (TRST) pin is not supported; however, MX devices contain power-on circuitry that resets
the boundary scan circuitry upon power-up. Also, the TMS pin is equipped with an internal pull-up
resistor. This allows the TAP controller to remain in or return to the Test-Logic-Reset state when there is
no input or when a logical 1 is on the TMS pin. To reset the controller, TMS must be HIGH for at least five
TCK cycles.
Boundary Scan Description Language (BSDL) File
Conforming to the IEEE Standard 1149.1 requires that the operation of the various JTAG components be
documented. The BSDL file provides the standard format to describe the JTAG components that can be
used by automatic test equipment software. The file includes the instructions that are supported,
instruction bit pattern, and the boundary-scan chain order. For an in-depth discussion on BSDL files,
please refer to Actel BSDL Files Format Description application note.
BSDL files are grouped into two categories - generic and device-specific. The generic files assign all user
I/Os as inouts. Device-specific files assign user I/Os as inputs, outputs or inouts.
Generic files for MX devices are available on the Microsemi SoC Product Group's website:
Figure 1-14 Device Selection Wizard
Table 1-5
Boundary Scan Pin Configuration and Functionality
Reserve JTAG
Checked
Unchecked
TCK
BST input; must be terminated to logical HIGH or LOW to avoid floating
User I/O
TDI, TMS
BST input; may float or be tied to HIGH
User I/O
TDO
BST output; may float or be connected to TDI of another device
User I/O
相关PDF资料
PDF描述
EP4CGX110DF31C7 IC CYCLONE IV FPGA 110K 896FBGA
A42MX36-1PQG208I IC FPGA MX SGL CHIP 54K 208-PQFP
A42MX36-1PQ208I IC FPGA MX SGL CHIP 54K 208-PQFP
EP1SGX10CF672C6N IC STRATIX GX FPGA 10KLE 672FBGA
A42MX36-2PQ240 IC FPGA MX SGL CHIP 54K 240-PQFP
相关代理商/技术参数
参数描述
A42MX36-1BGG272I 功能描述:IC FPGA MX SGL CHIP 54K 272-PBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A42MX36-1BGG272M 制造商:Microsemi Corporation 功能描述:FPGA 54K GATES 1184 CELLS 90MHZ/151MHZ 0.45UM 3.3V/5V 272BGA - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 202 I/O 272PBGA
A42MX36-1CQ208 功能描述:IC FPGA MX SGL CHIP 54K 208-CQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A42MX36-1CQ208B 功能描述:IC FPGA MX SGL CHIP 54K 208-CQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A42MX36-1CQ208M 制造商:Microsemi Corporation 功能描述:FPGA 54K GATES 1184 CELLS 90MHZ/151MHZ 0.45UM 3.3V/5V 208CQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 54K 208-CQFP 制造商:Microsemi Corporation 功能描述:IC FPGA 176 I/O 208CQFP