参数资料
型号: A42MX36-BGG272
厂商: Microsemi SoC
文件页数: 55/142页
文件大小: 0K
描述: IC FPGA MX SGL CHIP 54K 272-PBGA
标准包装: 40
系列: MX
RAM 位总计: 2560
输入/输出数: 202
门数: 54000
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 272-BBGA
供应商设备封装: 272-PBGA(27x27)
40MX and 42MX FPGA Families
ii
R evis i o n 11
Ordering Information
Plastic Device Resources
User I/Os
Device
PLCC
44-Pin
PLCC
68-Pin
PLCC
84-Pin
PQFP
100-Pin
PQFP
160-Pin
PQFP
208-Pin
PQFP
240-Pin
VQFP
80-Pin
VQFP
100-Pin
TQFP
176-Pin
PBGA
272-Pin
A40MX02
34
57
57
57
A40MX04
34
57
69
69
A42MX09
72
83
101
83
104
A42MX16
72
83
125
140
83
140
A42MX24
72
125
176
150
A42MX36
–––––
176
202
202
Note:
Package Definitions
PLCC = Plastic Leaded Chip Carrier, PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, VQFP = Very Thin Quad
Flat Pack, PBGA = Plastic Ball Grid Array
_
Part Number
Speed Grade
Package Type
Package Lead Count
Lead-Free Packaging
Blank = Standard Packaging
G = RoHS Compliant Packaging
Blank = Commercial (0 to +70°C)
Application (Temperature Range)
PL = Plastic Leaded Chip Carrier
CQ =Ceramic Quad Flat Pack
BG = Plastic Ball Grid Array
VQ = Very Thin (1.0 mm) Quad Flat Pack
TQ = Thin (1.4 mm) Quad Flat Pack
PQ = Plastic Quad Flat Pack
Blank = Standard Speed
–1 = Approximately 15% Faster than Standard
–2 = Approximately 25% Faster than Standard
–3 = Approximately 35% Faster than Standard
–F = Approximately 40% Slower than Standard
A40MX02 = 3,000 System Gates
A40MX04 = 6,000 System Gates
A42MX09 = 14,000 System Gates
A42MX16 = 24,000 System Gates
A42MX24 = 36,000 System Gates
A42MX36 = 54,000 System Gates
A42MX16
1
PQ
100
G
ES
I = Industrial (–40 to +85°C)
M = Military (–55 to +125°C)
A = Automotive (–40 to +125°C)
B = MIL-STD-883
相关PDF资料
PDF描述
IDT71V016SA10PHG IC SRAM 1MBIT 10NS 44TSOP
W25Q32DWSFIG IC FLASH SPI 32MBIT 16SOIC
A42MX36-BG272 IC FPGA MX SGL CHIP 54K 272-PBGA
M1AFS600-1FG256K IC FPGA 4MB FLASH 600K 256-FBGA
A3PE3000L-FG896 IC FPGA 1KB FLASH 3M 896-FBGA
相关代理商/技术参数
参数描述
A42MX36-BGG272I 功能描述:IC FPGA MX SGL CHIP 54K 272-PBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A42MX36-BGG272M 制造商:Microsemi Corporation 功能描述:FPGA 42MX Family 54K Gates 1184 Cells 79MHz/131MHz 0.45um Technology 3.3V/5V 272-Pin BGA 制造商:Microsemi Corporation 功能描述:FPGA 54K GATES 1184 CELLS 79MHZ/131MHZ 0.45UM 3.3V/5V 272BGA - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 202 I/O 272PBGA
A42MX36-CQ208 功能描述:IC FPGA MX SGL CHIP 54K 208-CQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A42MX36-CQ208B 功能描述:IC FPGA MX SGL CHIP 54K 208-CQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:MX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A42MX36-CQ208M 制造商:Microsemi Corporation 功能描述:FPGA 54K GATES 1184 CELLS 79MHZ/131MHZ 0.45UM 3.3V/5V 208CQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 176 I/O 208CQFP 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 54K 208-CQFP