参数资料
型号: A4985SETTR-T
厂商: Allegro Microsystems Inc
文件页数: 12/22页
文件大小: 0K
描述: IC STEPPER MOTOR DRIVER 32QFN
特色产品: A498x Motor Driver Family
标准包装: 1
应用: 步进电机驱动器
评估套件: 可供
输出数: 1
电流 - 输出: ± 1A
电压 - 负载: 8 V ~ 35 V
电源电压: 3 V ~ 5.5 V
工作温度: -20°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 32-VFQFN 裸露焊盘
供应商设备封装: 32-QFN 裸露焊盘(5x5)
包装: 标准包装
其它名称: 620-1457-6
A4985
DMOS Microstepping Driver with Translator
And Overcurrent Protection
Application Layout
Layout . The printed circuit board should use a heavy ground-
plane. For optimum electrical and thermal performance, the
A4985 must be soldered directly onto the board. On the under-
side of the A4985 package is an exposed pad, which provides a
path for enhanced thermal dissipation. The thermal pad should be
soldered directly to an exposed surface on the PCB. Thermal vias
are used to transfer heat to other layers of the PCB.
In order to minimize the effects of ground bounce and offset
issues, it is important to have a low impedance single-point
ground, known as a star ground , located very close to the device.
By making the connection between the pad and the ground plane
directly under the A4985, that area becomes an ideal location for
a star ground point. A low impedance ground will prevent ground
bounce during high current operation and ensure that the supply
voltage remains stable at the input terminal.
The two input capacitors should be placed in parallel, and as
close to the device supply pins as possible. The ceramic capaci-
tor (CIN1) should be closer to the pins than the bulk capacitor
(CIN2). This is necessary because the ceramic capacitor will be
responsible for delivering the high frequency current components.
The sense resistors, RSx , should have a very low impedance
path to ground, because they must carry a large current while
supporting very accurate voltage measurements by the current
sense comparators. Long ground traces will cause additional
voltage drops, adversely affecting the ability of the comparators
to accurately measure the current in the windings. The SENSEx
pins have very short traces to the RSx resistors and very thick,
low impedance traces directly to the star ground underneath the
device. If possible, there should be no other components on the
sense circuits.
PCB
A4985
Solder
Trace (2 oz.)
Signal (1 oz.)
Ground (1 oz.)
Thermal (2 oz.)
OUT2B
OUT2A OUT1A
OUT1B
Thermal Vias
GND
OUT2B
OUT2A
OUT1A
OUT1B
R4
R5
GND
C7
R4
R5
C7
U1
OUT2B
ENABLE
GND
PAD
OUT1B
DIR
GND
C3
C4
C6
C1
BULK
GND
C3
C4
CP1
CP2
VCP
A4985
REF
STEP
VDD
C1
GND
ROSC
C2
VDD
VBB
CAPACITANCE
C6
ROSC
C2
ES package configuration shown
V DD
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
V BB
12
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
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