参数资料
型号: A54SX16A-FGG144A
厂商: Microsemi SoC
文件页数: 16/108页
文件大小: 0K
描述: IC FPGA SX 24K GATES 144-FBGA
标准包装: 160
系列: SX-A
LAB/CLB数: 1452
输入/输出数: 111
门数: 24000
电源电压: 2.25 V ~ 5.25 V
安装类型: 表面贴装
工作温度: -40°C ~ 125°C
封装/外壳: 144-LBGA
供应商设备封装: 144-FPBGA(13x13)
SX-A Family FPGAs
v5.3
1-11
Probing Capabilities
SX-A devices also provide an internal probing capability
that is accessed with the JTAG pins. The Silicon Explorer II
diagnostic hardware is used to control the TDI, TCK, TMS,
and TDO pins to select the desired nets for debugging.
The user assigns the selected internal nets in Actel Silicon
Explorer II software to the PRA/PRB output pins for
observation. Silicon Explorer II automatically places the
device into JTAG mode. However, probing functionality is
only activated when the TRST pin is driven high or left
floating, allowing the internal pull-up resistor to pull
TRST High. If the TRST pin is held Low, the TAP controller
remains in the Test-Logic-Reset state so no probing can
be performed. However, the user must drive the TRST pin
High or allow the internal pull-up resistor to pull TRST
High.
When selecting the Reserve Probe Pin box as shown in
Figure 1-12 on page 1-9, direct the layout tool to reserve
the PRA and PRB pins as dedicated outputs for probing.
This Reserve option is merely a guideline. If the designer
assigns user I/Os to the PRA and PRB pins and selects the
Reserve
Probe
Pin option, Designer Layout will
override the Reserve Probe Pin option and place the
user I/Os on those pins.
To allow probing capabilities, the security fuse must not
be programmed. Programming the security fuse disables
the JTAG and probe circuitry. Table 1-9 summarizes the
possible device configurations for probing once the
device leaves the Test-Logic-Reset JTAG state.
Table 1-9 Device Configuration Options for Probe Capability (TRST Pin Reserved)
JTAG Mode
TRST1
Security Fuse Programmed
PRA, PRB2
TDI, TCK, TDO2
Dedicated
Low
No
User I/O3
JTAG Disabled
High
No
Probe Circuit Outputs
JTAG I/O
Flexible
Low
No
User I/O3
High
No
Probe Circuit Outputs
JTAG I/O
Yes
Probe Circuit Secured
Notes:
1. If the TRST pin is not reserved, the device behaves according to TRST = High as described in the table.
2. Avoid using the TDI, TCK, TDO, PRA, and PRB pins as input or bidirectional ports. Since these pins are active during probing, input
signals will not pass through these pins and may cause contention.
3. If no user signal is assigned to these pins, they will behave as unused I/Os in this mode. Unused pins are automatically tristated by
the Designer software.
相关PDF资料
PDF描述
A54SX16A-FG144A IC FPGA SX 24K GATES 144-FBGA
AGL400V5-CS196I IC FPGA 1KB FLASH 400K 196-CSP
HMC40DRXS-S734 CONN EDGECARD 80POS DIP .100 SLD
ACC43DRYN-S13 CONN EDGECARD 86POS .100 EXTEND
ACC43DRYH-S13 CONN EDGECARD 86POS .100 EXTEND
相关代理商/技术参数
参数描述
A54SX16A-FGG144I 功能描述:IC FPGA SX 24K GATES 144-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX-A 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A54SX16A-FGG144M 制造商:Microsemi Corporation 功能描述:FPGA SX-A Family 16K Gates 924 Cells 227MHz 0.25um Technology 2.5V 144-Pin FBGA 制造商:Microsemi Corporation 功能描述:FPGA SX-A 16K GATES 924 CELLS 227MHZ 0.25UM/0.22UM 2.5V 144F - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 111 I/O 144FBGA 制造商:Microsemi Corporation 功能描述:IC FPGA 24K GATES 144FBGA
A54SX16A-FGG256 功能描述:IC FPGA SX 24K GATES 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX-A 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A54SX16A-FGG256A 功能描述:IC FPGA SX 24K GATES 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX-A 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
A54SX16A-FGG256I 功能描述:IC FPGA SX 24K GATES 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX-A 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)