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参数资料
| 型号： | A80960JD-50 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 3.3 V EMBEDDED 32-BIT MICROPROCESSOR |
| 中文描述： | 32-BIT, 50 MHz, RISC PROCESSOR, CPGA132 |
| 封装： | PGA-132 |
| 文件页数： | 34/78页 |
| 文件大小： | 835K |
| 代理商： | A80960JD-50 |
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80960JA/JF/JD/JT 3.3 V Microprocessor
34
Advance Information Datasheet
3.2
Package Thermal Specifications
The 80960Jx is specified for operation when T
C
(case temperature) is within the range of
0°C to
100°C for PGA, MPBGA and PQFP packages. An extended temperature device is also available in
a PQFP package with T
C
-40°C to 100°C. Case temperature may be measured in any environment
to determine whether the 80960Jx is within its specified operating range. The case temperature
should be measured at the center of the top surface, opposite the pins.
θ
CA
is the thermal resistance from case to ambient. Use the following equation to calculate T
A
, the
maximum ambient temperature to conform to a particular case temperature:
T
A
= T
C
- P (
θ
CA
)
Junction temperature (T
J
) is commonly used in reliability calculations. T
J
can be calculated from
θ
JC
(thermal resistance from junction to case) using the following equation:
T
J
= T
C
+ P (
θ
JC
)
Similarly, if T
A
is known, the corresponding case temperature (T
C
) can be calculated as follows:
T
C
= T
A
+ P (
θ
CA
)
Compute P by multiplying I
CC
from Table 22 and V
CC
. Values for
θ
JC
and
θ
CA
are given in
Table 12 for the PGA package, Table 13 for the MPBGA package, and Table 14 for the PQFP
package. For high speed operation, the processor’s
θ
JA
may be significantly reduced by adding a
heatsink and/or by increasing airflow.
Tables 15, 16, and 17 show the maximum ambient temperature (T
A
) permitted without exceeding
T
C
for the PGA, MPBGA, and PQFP packages. The values are based on typical I
CC
and V
CC
of
+3.3 V, with a T
CASE
of +100°C.
L13
NC
M10
XINT2
N7
TDO
P4
V
CC
L14
RDYRCV
M11
XINT0
N8
NC
P5
WIDTH0
M1
DT/R
M12
TMS
N9
XINT4
P6
WIDTH1
M2
V
CC
M13
TRST
N10
NC
P7
FAIL
M3
NC
M14
TCK
N11
XINT6
P8
NC
M4
NC
N1
W/R
N12
XINT1
P9
NC
M5
A3
N2
D/C
N13
XINT3
P10
NMI
M6
V
CC
N3
NC
N14
HOLD
P11
XINT7
M7
ALE
N4
NC
P1
NC
P12
XINT5
M8
VCC5
N5
A2
P2
ADS
P13
V
CC
M9
V
CC
N6
V
CC
P3
BLAST
P14
NC
Table 11.
196-Ball MPBGA Pinout — In Pin Order (Sheet 2 of 2)
Pin
Signal
Pin
Signal
Pin
Signal
Pin
Signal
NOTE:
Do not connect any external logic to pins marked NC (no connect pins).
相关PDF资料 |
PDF描述 |
|---|---|
| A80960JD-66 | 3.3 V EMBEDDED 32-BIT MICROPROCESSOR |
| A80960HT60 | 80960HA/HD/HT 32-Bit High-Performance Superscalar Processor |
| A80960JF-16 | EMBEDDED 32-BIT MICROPROCESSOR |
| A80960JF-25 | EMBEDDED 32-BIT MICROPROCESSOR |
| A80960JT-75 | EMBEDDED 32-BIT MICROPROCESSOR |
相关代理商/技术参数 |
参数描述 |
|---|---|
| A80960JD-66 | 制造商:INTEL 制造商全称:Intel Corporation 功能描述:EMBEDDED 32-BIT MICROPROCESSOR |
| A80960JF-16 | 制造商:INTEL 制造商全称:Intel Corporation 功能描述:EMBEDDED 32-BIT MICROPROCESSOR |
| A80960JF-25 | 制造商:INTEL 制造商全称:Intel Corporation 功能描述:EMBEDDED 32-BIT MICROPROCESSOR |
| A80960JF33 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| A80960JF-33 | 制造商:INTEL 制造商全称:Intel Corporation 功能描述:EMBEDDED 32-BIT MICROPROCESSOR |
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