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参数资料
| 型号： | A82DL1632UG-70I |
| 厂商： | AMIC Technology Corporation |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| 中文描述： | 堆叠式多芯片封装（MCP）闪存和SRAM，A82DL16x2T（ü）16兆位（2Mx8 Bit/1Mx16位）的CMOS 3.3伏只，同时闪电行动 |
| 文件页数： | 37/57页 |
| 文件大小： | 883K |
| 代理商： | A82DL1632UG-70I |
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A82DL16x2T(U) Series
PRELIMINARY
(May, 2005, Version 0.1)
36
AMIC Technology, Corp.
Data Output
(I/O
0
-I/O
14
)
Data Output
(I/O
0
-I/O
7
)
I/O
15
Output
Address Input
Data Output
(I/O
0
-I/O
14
)
Data Output
(I/O
0
-I/O
7
)
I/O
15
Output
Address Input
t
FHQV
t
FLQZ
t
ELFH
t
ELFL
CE_F
OE
BYTE_F
I/O
0
-I/O
14
I/O
15
(A-1)
BYTE_F
I/O
0
-I/O
14
I/O
15
(A-1)
BYTE_F
Switching
from word to
byte mode
BYTE _F
Switching
from byte to
word mode
AC CHARACTERISTICS
Word/Byte Configuration (
BYTE_F
)
Parameter
Speed Option
JEDEC
Std
Description
-70
5
Unit
t
ELFL/
t
ELFH
CE_F
to
BYTE_F
Switching Low or High
Max
ns
t
FLQZ
BYTE_F
Switching Low to Output High-Z
Max
25
ns
t
HQV
BYTE_F
Switching High to Output Active
Min
70
ns
Figure 13.
BYTE_F
Timings for Read Operations
Figure 14.
BYTE_F
Timings for Write Operations
Note:
Refer to the Erase/Program Operations table for t
AS
and t
AH
specifications.
The falling edge of the last WE signal
t
HOLD
(t
AH
)
t
SET
(t
AS
)
CE_F
BYTE_F
WE
相关PDF资料 |
PDF描述 |
|---|---|
| A82DL1642UG-70I | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1632UG-70IF | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1642UG-70IF | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1632UG-70U | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1642UG-70U | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
相关代理商/技术参数 |
参数描述 |
|---|---|
| A82DL1632UG-70IF | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1632UG-70U | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1632UG-70UF | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL1634 | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1634TG-70 | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
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