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参数资料
型号： A82DL1632UG-70I
厂商： AMIC Technology Corporation
英文描述： Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash
中文描述： 堆叠式多芯片封装（MCP）闪存和SRAM，A82DL16x2T（ü）16兆位（2Mx8 Bit/1Mx16位）的CMOS 3.3伏只，同时闪电行动
文件页数： 38/57页
文件大小： 883K
代理商： A82DL1632UG-70I
A82DL16x2T(U) Series
PRELIMINARY
(May, 2005, Version 0.1)
37
AMIC Technology, Corp.
AC CHARACTERISTICS
Erase and Program Operations
Parameter
Description
Speed
Unit
JEDEC
Std
-70
t
AVAV
t
WC
Write Cycle Time (Note 1)
Min.
70
ns
t
AVWL
t
AS
Address Setup Time
Min.
0
ns
t
ASO
Address Setup Time to
OE
low during toggle bit polling
15
ns
t
WLAX
t
AH
Address Hold Time
Min.
45
ns
t
AHT
Address Hold Time From
CE_F
or
OE
high during
toggle bit polling
0
ns
t
DVWH
t
DS
Data Setup Time
Min.
35
ns
t
WHDX
t
DH
Data Hold Time
Min.
0
ns
t
OEPH
Output Enable High during toggle bit polling
Min.
20
ns
t
GHWL
t
GHWL
Read Recover Time Before Write
(
OE
high to
WE
low)
Min.
0
ns
t
ELWL
t
CS
CE_F
Setup Time
Min.
0
ns
t
WHEH
t
CH
CE_F
Hold Time
Min.
0
ns
t
WLWH
t
WP
Write Pulse Width
Min.
30
ns
t
WHDL
t
WPH
Write Pulse Width High
Min.
30
ns
t
SR/W
Latency Between Read and Write Operations
Min.
0
Byte
Typ.
5
t
WHWH1
t
WHWH1
Byte Programming Operation
(Note 2)
Word
Typ.
7
μ
s
t
WHWH1
t
WHWH1
Accelerated Programming Operation,
Word or Byte (Note 2)
Typ.
4
sec
t
WHWH2
t
WHWH2
Sector Erase Operation (Note 2)
Typ.
0.7
sec
t
vcs
VCC_F Set Up Time (Note 1)
Min.
50
μ
s
t
RB
Recovery Time from RY/
BY
Min
0
ns
t
BUSY
Program/Erase Valid to RY/
BY
Delay
Min
90
ns
Notes:
1. Not 100% tested.
2. See the "Erase and Programming Performance" section for more information.
相关PDF资料
PDF描述
A82DL1642UG-70I Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash
A82DL1632UG-70IF Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash
A82DL1642UG-70IF Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash
A82DL1632UG-70U Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash
A82DL1642UG-70U Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash
相关代理商/技术参数
参数描述
A82DL1632UG-70IF 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash
A82DL1632UG-70U 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash
A82DL1632UG-70UF 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x2T(U) 16 Megabit (2Mx8 Bit/1Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash
A82DL1634 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S
A82DL1634TG-70 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S
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