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参数资料
| 型号： | A82DL3234TG-70IF |
| 厂商： | AMIC Technology Corporation |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| 中文描述： | 堆叠式多芯片封装（MCP）闪存和SRAM，A82DL32x4T（ü）32兆位（4Mx8 Bit/2Mx16位）的CMOS 3.3伏只，同时闪电行动 |
| 文件页数： | 4/60页 |
| 文件大小： | 931K |
| 代理商： | A82DL3234TG-70IF |
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A82DL32x4T(U) Series
PRELIMINARY
(August, 2005, Version 0.0)
3
AMIC Technology, Corp.
Pin Configurations
69-Ball TFBGA
Top View
A5
A6
A10
B3
B4
B5
B6
B7
B8
C3
C4
C5
C6
C7
C8
C9
D4
D4
D5
D6
D7
D8
D9
E3
E4
E7
E8
E9
E10
F3
F4
F7
F8
F9
F10
NC
NC
NC
A7
LB_S
WP/ACC
WE
A8
A11
A6
UB_S
RESET
CE2_S
A19
A12
A15
A5
A18
RY/BY
NC
A9
A13
NC
A4
A17
A10
A14
NC
NC
VSS
I/O1
I/O6
NC
A16
NC
Flash only
SRAM only
Shared
A1
B1
C2
D2
E1
E2
F1
F2
NC
NC
A3
A2
NC
A1
NC
A0
G3
G4
G5
G6
G7
G8
G9
H3
H4
H5
H6
H7
H8
H9
I/O9
I/O3
I/O4
I/O13
I/O15(A-1) BYTE_F
I/O0
I/O10
VCC_F
VCC_S
I/O12
I/O7
VSS
G2
H2
CE_F
OE
CE1_S
J3
J4
J5
J6
J7
J8
K5
K6
K10
I/O8
I/O2
I/O11
NC
I/O5
I/O14
NC
NC
NC
K1
NC
Special Handling Instructions for TFBGA Package
Special handling is required for Flash Memory products in TFBGA packages.
Flash memory devices in TFBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or
data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time
相关PDF资料 |
PDF描述 |
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| A82DL3244TG-70IF | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL3224 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL3224TG-70U | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL3224TG-70UF | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL3224UG-70U | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
相关代理商/技术参数 |
参数描述 |
|---|---|
| A82DL3234TG-70U | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL3234TG-70UF | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL3234UG-70 | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL3234UG-70F | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
| A82DL3234UG-70I | 制造商:AMICC 制造商全称:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash |
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