参数资料
型号: A8507ELBTR-T
厂商: Allegro Microsystems Inc
文件页数: 12/17页
文件大小: 0K
描述: IC DRIVER WLED/RGB 24-SOIC
标准包装: 3,000
拓扑: PWM,升压(升压)
输出数: 6
内部驱动器:
类型 - 主要: 背光
类型 - 次要: RGB,白色 LED
频率: 250kHz ~ 1MHz
电源电压: 4.3 V ~ 5.5 V
安装类型: 表面贴装
封装/外壳: 24-SOIC(0.295",7.50mm 宽)
供应商设备封装: 24-SOIC W
包装: 带卷 (TR)
工作温度: -40°C ~ 85°C
A8507
LED Backlight Driver for LCD Monitors and Televisions
Application Information
PCB Layout Guidelines As with any switching power supply,
care should be taken in laying out the board. A switching power
supply has sources of high dv/dt and high di/dt which can cause
malfunction. All general norms should be followed for board
layout. Refer to figure 14 for a typical application schematic. The
A8507 evaluation board provides a useful model for designing
application circuit layouts.
The following guidelines should be observed:
? Place the supply bypass capacitor (C5) close to the VIN pin and
the ground plane.
? Route analog ground, digital signal ground, LED ground
(LGND pin), and power ground (PGND pin) separately. Con-
nect all these grounds at the common ground plane under the
A8507, serving as a star ground.
? Place the input capacitors (C1, C2), inductor (L1), boost diode
(D1), MOSFET (Q1), and output capacitors (C3, C4) so that
they form the smallest loop practical. Avoid long traces for
these paths.
? Place the resistors R FSET and R ISET , and the compensation com-
ponents (Rz and Cz) close to the FSET, ISET, and COMP pins,
respectively. Connect the other ends to the common star ground.
? A8507 has 50 k Ω internal pull-down resistors on the EN and
PWM pins to keep these pins low while driving through tri-state
state (for example, shutdown). Add external resistors R2 and
R3 between the EN and PWM pins and ground, for added noise
immunity. Connect these resistors close to the pins and return to
the common star ground.
? Sense voltage across R SC with smaller length traces. Place the
SENP and SENN traces as close to each other as possible to
minimize noise pickup. Connect the SENN trace to the negative
end of the resistor and do not connect it to power ground plane.
? Provide a substantial copper plane near MOSFET Q1 and the
IC, to provide good thermal conduction.
? Place R OVP as close as possible to the OVP pin. A long trace
between R OVP and the OVP pin may pick up switching noises
and cause overvoltage protection to trip prematurely.
V OUT
8 LEDs per string
V BAT
8 to 21 V
C1
P
C2
L1
10
Q1
R SC
7
D1
6
P
R OVP
8
C3
P
C4
V BIAS
4.5 to 5.5 V
DRIVER SENP SENN
11 VIN
OVP
R1
C5
23 FAULT
A8507
(LP package)
LED1
16
R FSET
R ISET
R2
R3
Rz1
24
2
15
14
12
3
EN
PWM
COMP
FSET
ISET
NC
LED2
LED3
LED4
LED5
17
18
20
21
Cz1
5
9
NC
NC
GND GND
PAD
LED6
LGND PGND
22
1
13
19
4
P
R2, R3 optional (A8507 has
internal pull-down resistors)
Figure 14. Typical application circuit
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
11
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