参数资料
型号: ACPM-7821-BLK
元件分类: 放大器
英文描述: 898 MHz - 925 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER
封装: 4 X 4 MM, 1.10 MM HEIGHT, SMT PACKAGE-10
文件页数: 2/16页
文件大小: 452K
代理商: ACPM-7821-BLK
10
PCB Design Guidelines
The recommended ACPM-7821 PCB Land pattern is
shown in Figure 14 and Figure 15. The substrate is
coated with solder mask between the I/O and con-
ductive paddle to protect the gold pads from short
circuit that is caused by solder bleeding/bridging.
Stencil Design Guidelines
A properly designed solder screen or stencil is
required to ensure optimum amount of solder paste
is deposited onto the PCB pads.
The recommended stencil layout is shown in Figure
16. Reducing the stencil opening can potentially
generate more voids. On the other hand, stencil open-
ings larger than 100% will lead to excessive solder
paste smear or bridging across the I/O pads or
conductive paddle to adjacent I/O pads. Considering
the fact that solder paste thickness will directly affect
the quality of the solder joint, a good choice is to use
laser cut stencil composed of 0.100 mm (4 mils) or
0.127 mm (5 mils) thick stainless steel which is capable
of producing the required fine stencil outline.
Figure 14. Metallization.
Figure 15. Solder Mask Opening.
Figure 16. Solder Paste Stencil Aperture.
0.25
0.85
0.4
0.7
0.6
0.3mm
on 0.6mm pitch
0.1
0.8
0.5
0.65
0.85
2.0
0.6
1.8
0.8 x 0.5
0.8 x 0.6
0.7
0.6
1.6
0.85
0.4
相关PDF资料
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ACPM-7822-BLK 898 MHz - 925 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER
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相关代理商/技术参数
参数描述
ACPM-7821-TR1 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:4 x 4 Power Amplifier Module for J-CDMA (898 - 925 MHz)
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ACPM-7822-BLK 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:JCDMA 4x4 Power Amplifier Module (898-925MHz)
ACPM-7822-TR1 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:JCDMA 4x4 Power Amplifier Module (898-925MHz)
ACPM-7831-BLK 制造商:未知厂家 制造商全称:未知厂家 功能描述:Amplifier. Other