- 您现在的位置：买卖IC网 > PDF目录97841 > ACPM-7821-BLK 898 MHz - 925 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER PDF资料下载
参数资料
| 型号： | ACPM-7821-BLK |
| 元件分类： | 放大器 |
| 英文描述： | 898 MHz - 925 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封装： | 4 X 4 MM, 1.10 MM HEIGHT, SMT PACKAGE-10 |
| 文件页数： | 7/16页 |
| 文件大小： | 452K |
| 代理商： | ACPM-7821-BLK |
15
Storage Conditions
Packages described in this document must be stored
in sealed moisture barrier, anti-static bags. Shelf life
in a sealed moisture barrier bag is 12 months at <40
°C
and 90% relative humidity (RH) J-STD-033 p.7.
Out-of-Bag Time Duration
After unpacking the device must be soldered to the
PCB within 168 hours as listed in the J-STD-020B
p.11 with factory conditions <30oC and 60% RH.
Baking
It is not necessary to re-bake the part if both condi-
tions
(storage
conditions
and
out-of-bag
condition) have been satisfied. Baking must be done
if at least one of t he conditions above have
not been satisfied. The baking conditions are 125
°C
for 24 hours J-STD-033 p.8.
CAUTION: Tape and reel materials typically cannot
be baked at the temperature described above.
If out-of-bag exposure time is exceeded, parts must
be baked for a longer time at low temperatures, or
the parts must be re-reeled, de-taped, re-baked and
then put back on tape and reel. (See moisture sensi-
tive warning label on each shipping bag for informa-
tion of baking)
Board Rework
Component Removal, Rework and Remount
If a component is to be removed from the board, it is
recommended that localized heating be used and the
maximum body temperatures of any surface mount
component on the board not exceed 200
°C. This
method will minimize moisture related component
damage. If any component temperature exceeds
200
°C, the board must be baked dry per 4-2 prior to
rework and/or component removal. Component tem-
peratures shall be measured at the top center of the
package body. Any SMD packages that have not ex-
ceeded their floor life can be exposed to a maximum
body temperature as high as their specified maximum
reflow temperature.
Removal for Failure Analysis
Not following the requirements of 4-1 may cause
moisture/reflow damage that could hinder or com-
pletely prevent the determination of the original fail-
ure mechanism.
Baking of Populated Boards
Some SMD packages and board materials are not able
to withstand long duration bakes at 125
°C. Examples
of this are some FR-4 materials, which cannot with-
stand a 24 hr bake at 125
°C. Batteries and electro-
lytic capacitors are also temperature sensitive. With
component and board temperature restrictions in
mind, choose a bake temperature from Table 4-1 in
J-STD 033; then determine the appropriate bake
duration based on the component to be removed. For
additional considerations see IPC-7711 and IPC-7721.
Derating due to Factory Environmental Conditions
Factory f loor life exposures for SMD packages
removed from the dry bags will be a function of the
ambient environmental conditions. A safe, yet con-
servative, handling approach is to expose the SMD
packages only up to the maximum time limits for each
moisture sensitivity level as shown in Table 6. This
approach, however, does not work if the factory hu-
midity or temperature are greater than the testing
conditions of 30
°C/60% RH. A solution for address-
ing this problem is to derate the exposure times based
on the knowledge of moisture diffusion in the com-
ponent packaging materials (ref. JESD22-A120). Rec-
ommended equivalent total floor life exposures can
be estimated for a range of humidity’s and tempera-
tures based on the nominal plastic thickness for each
device. Table 8 lists equivalent derated floor lives for
humidity’s ranging from 20– 90% RH for three tem-
peratures, 20
°C, 25°C, and 30°C. This table is appli-
cable to SMDs molded with novolac, biphenyl or mul-
tifunctional epoxy mold compounds. The following
assumptions were used in calculating Table 8:
1. Activation Energy for diffusion = 0.35eV
(smallest known value).
2. For
≤60% RH, use Diffusivity = 0.121exp
(- 0.35eV/kT) mm2/s (this uses smallest known
Diffusivity @ 30
°C).
3. For >60% RH, use Diffusivity = 1.320exp
(- 0.35eV/kT) mm2/s (this uses largest known
Diffusivity @ 30
°C).
Handling and Storage, continued
相关PDF资料 |
PDF描述 |
|---|---|
| ACPM-7822-BLK | 898 MHz - 925 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER |
| ACPM-7822-TR1 | 898 MHz - 925 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER |
| ACPM-7833-BLK | 1850 MHz - 1910 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| ACPM-7833-TR1 | 1850 MHz - 1910 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| ACPM-7833-BLK | 1850 MHz - 1910 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ACPM-7821-TR1 | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:4 x 4 Power Amplifier Module for J-CDMA (898 - 925 MHz) |
| ACPM-7822 | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:JCDMA 4x4 Power Amplifier Module (898-925MHz) |
| ACPM-7822-BLK | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:JCDMA 4x4 Power Amplifier Module (898-925MHz) |
| ACPM-7822-TR1 | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:JCDMA 4x4 Power Amplifier Module (898-925MHz) |
| ACPM-7831-BLK | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Amplifier. Other |
发布紧急采购，3分钟左右您将得到回复。