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参数资料
| 型号： | ACPM-7822-BLK |
| 元件分类： | 放大器 |
| 英文描述： | 898 MHz - 925 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER |
| 封装： | 4 X 4 MM, 0.90 MM HEIGHT, GREEN, PLASTIC, SMT, 10 PIN |
| 文件页数： | 4/13页 |
| 文件大小： | 1112K |
| 代理商： | ACPM-7822-BLK |
12
Storage Condition
Packages described in this document must be stored
in sealed moisture barrier, antistatic bags. Shelf life in a
sealed moisture barrier bag is 12 months at <40°C and
90% relative humidity (RH) J-STD-033 p.7.
Out-of-Bag Time Duration
After unpacking the device must be soldered to the PCB
within 168 hours as listed in the J-STD-020B p.11 with
factory conditions <30°C and 60% RH.
Baking
It is not necessary to re-bake the part if both conditions
(storage conditions and out-of bag conditions) have been
satisfied. Baking must be done if at least one of the con-
ditions above have not been satisfied. The baking condi-
tions are 125°C for 12 hours J-STD-033 p.8.
CAUTION
Tape and reel materials typically cannot be baked at the
temperature described above. If out-of-bag exposure
time is exceeded, parts must be baked for a longer time
at low temperatures, or the parts must be de-reeled,
de-taped, re-baked and then put back on tape and reel.
(See moisture sensitive warning label on each shipping
bag for information of baking).
Board Rework
Component Removal, Rework and Remount
If a component is to be removed from the board, it is
recommended that localized heating be used and the
maximum body temperatures of any surface mount
component on the board not exceed 200°C. This method
will minimize moisture related component damage. If any
component temperature exceeds 200°C, the board must
be baked dry per 4-2 prior to rework and/or component
removal. Component temperatures shall be measured at
the top center of the package body. Any SMD packages
that have not exceeded their floor life can be exposed to
a maximum body temperature as high as their specified
maximum reflow temperature.
Removal for Failure Analysis
Notfollowingtheaboverequirementsmaycausemoisture/
reflow damage that could hinder or completely prevent
the determination of the original failure mechanism.
Baking of Populated Boards
Some SMD packages and board materials are not able to
withstand long duration bakes at 125°C. Examples of this
are some FR-4 materials, which cannot withstand a 24 hr
bake at 125°C. Batteries and electrolytic capacitors are
also temperature sensitive. With component and board
temperature restrictions in mind, choose a bake tem-
perature from Table 4-1 in J-STD 033; then determine the
appropriate bake duration based on the component to
be removed. For additional considerations see IPC-7711
andIPC-7721.
Derating due to Factory Environmental Conditions
Factory floor life exposures for SMD packages removed
from the dry bags will be a function of the ambient envi-
ronmental conditions. A safe, yet conservative, handling
approach is to expose the SMD packages only up to the
maximum time limits for each moisture sensitivity level
as shown in next table. This approach, however, does not
work if the factory humidity or temperature is greater
than the testing conditions of 30°C/60% RH. A solution
for addressing this problem is to derate the exposure
times based on the knowledge of moisture diffusion in
the component package materials ref. JESD22-A120).
Recommended equivalent total floor life exposures can
be estimated for a range of humidities and temperatures
based on the nominal plastic thickness for each device.
Table on next page lists equivalent derated floor lives for
humidities ranging from 20-90% RH for three tempera-
ture, 20°C, 25°C, and 30°C.
Table on next page is applicable to SMDs molded
with novolac, biphenyl or multifunctional epoxy mold
compounds. The following assumptions were used in cal-
culating this table:
1. Activation Energy for diffusion = 0.35eV (smallest
known value).
2. For ≤60% RH, use Diffusivity = 0.121exp ( -0.35eV/kT)
mm2/s (this used smallest known Diffusivity @ 30°C).
3. For >60% RH, use Diffusivity = 1.320exp ( -0.35eV/kT)
mm2/s (this used largest known Diffusivity @ 30°C).
相关PDF资料 |
PDF描述 |
|---|---|
| ACPM-7822-TR1 | 898 MHz - 925 MHz RF/MICROWAVE NARROW BAND LOW POWER AMPLIFIER |
| ACPM-7833-BLK | 1850 MHz - 1910 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| ACPM-7833-TR1 | 1850 MHz - 1910 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| ACPM-7833-BLK | 1850 MHz - 1910 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| ACPM-7833-TR1 | 1850 MHz - 1910 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ACPM-7822-TR1 | 制造商:AVAGO 制造商全称:AVAGO TECHNOLOGIES LIMITED 功能描述:JCDMA 4x4 Power Amplifier Module (898-925MHz) |
| ACPM-7831-BLK | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Amplifier. Other |
| ACPM-7831-TR1 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Amplifier. Other |
| ACPM-7833 | 制造商:AGILENT 制造商全称:AGILENT 功能描述:CDMA1900 (PCS) Power Amplifier Module |
| ACPM-7833-BLK | 功能描述:射频放大器 CDMA Amp 1850-1910MHz RoHS:否 制造商:Skyworks Solutions, Inc. 类型:Low Noise Amplifier 工作频率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 输出截获点:37.5 dBm 功率增益类型:32 dB 噪声系数:0.85 dB 工作电源电压:5 V 电源电流:125 mA 测试频率:2.6 GHz 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-16 封装:Reel |
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