参数资料
| 型号： | AD5324BRMZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 13/24页 |
| 文件大小： | 0K |
| 描述： | IC DAC 12BIT QUAD VOUT 10-MSOP |
| 产品培训模块： | Data Converter Fundamentals DAC Architectures |
| 标准包装： | 50 |
| 设置时间： | 8µs |
| 位数： | 12 |
| 数据接口： | DSP，MICROWIRE?，QSPI?，串行，SPI? |
| 转换器数目： | 4 |
| 电压电源： | 单电源 |
| 工作温度： | -40°C ~ 105°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-TFSOP，10-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 10-MSOP |
| 包装： | 管件 |
| 输出数目和类型： | 4 电压，单极；4 电压，双极 |
| 采样率（每秒）： | 125k |
| 产品目录页面： | 782 (CN2011-ZH PDF) |
AD5304/AD5314/AD5324
Data Sheet
Rev. H | Page 20 of 24
POWER SUPPLY BYPASSING AND GROUNDING
In any circuit where accuracy is important, careful consideration of
the power supply and ground return layout helps to ensure the
rated performance. The printed circuit board on which the
AD5304/AD5314/AD5324 is mounted is designed so that the
analog and digital sections are separated and confined to certain
areas of the board. If the AD5304/AD5314/AD5324 are in a
system where multiple devices require an AGND-to-DGND
connection, the connection is made at one point only. The star
ground point is established as close as possible to the device. The
AD5304/AD5314/AD5324 has ample supply bypassing of 10 μF in
parallel with 0.1 μF on the supply located as close to the package as
possible, ideally right up against the device. The 10 μF capacitors
are the tantalum bead type. The 0.1 μF capacitor has low effective
series resistance (ESR) and effective series inductance (ESI), like
the common ceramic types that provide a low impedance path
to ground at high frequencies, to handle transient currents due
to internal logic switching.
The power supply lines of the AD5304/AD5314/AD5324 use as
large a trace as possible to provide low impedance paths and reduce
the effects of glitches on the power supply line. Fast switching
signals such as clocks are shielded with digital ground to avoid
radiating noise to other parts of the board, and are never run
near the reference inputs. Avoid crossover of digital and analog
signals. Traces on opposite sides of the board run at right angles
to each other. This reduces the effects of feedthrough through
the board. A microstrip technique is by far the best, but is not
always possible with a double-sided board. In this technique,
the component side of the board is dedicated to a ground plane
while signal traces are placed on the solder side.
Table 7. Overview of AD53xx Serial Devices
Part No.
Resolution
No. of DACs
DNL
Interface
Settling Time (μs)
Package
Pins
SINGLES
AD5300
8
1
±0.25
SPI
4
SOT-23, MSOP
6, 8
AD5310
10
1
±0.5
SPI
6
SOT-23, MSOP
6, 8
AD5320
12
1
±1.0
SPI
8
SOT-23, MSOP
6, 8
AD5301
8
1
±0.25
2-Wire
6
SOT-23, MSOP
6, 8
AD5311
10
1
±0.5
2-Wire
7
SOT-23, MSOP
6, 8
AD5321
12
1
±1.0
2-Wire
8
SOT-23, MSOP
6, 8
DUALS
AD5302
8
2
±0.25
SPI
6
MSOP
8
AD5312
10
2
±0.5
SPI
7
MSOP
8
AD5322
12
2
±1.0
SPI
8
MSOP
8
AD5303
8
2
±0.25
SPI
6
TSSOP
16
AD5313
10
2
±0.5
SPI
7
TSSOP
16
AD5323
12
2
±1.0
SPI
8
TSSOP
16
QUADS
AD5304
8
4
±0.25
SPI
6
MSOP, LFCSP
10
AD5314
10
4
±0.5
SPI
7
MSOP, LFCSP
10
AD5324
12
4
±1.0
SPI
8
MSOP, LFCSP
10
AD5305
8
4
±0.25
2-Wire
6
MSOP
10
AD5315
10
4
±0.5
2-Wire
7
MSOP
10
AD5325
12
4
±1.0
2-Wire
8
MSOP
10
AD5306
8
4
±0.25
2-Wire
6
TSSOP
16
AD5316
10
4
±0.5
2-Wire
7
TSSOP
16
AD5326
12
4
±1.0
2-Wire
8
TSSOP
16
AD5307
8
4
±0.25
SPI
6
TSSOP
16
AD5317
10
4
±0.5
SPI
7
TSSOP
16
AD5327
12
4
±1.0
SPI
8
TSSOP
16
OCTALS
AD5308
8
±0.25
SPI
6
TSSOP
16
AD5318
10
8
±0.5
SPI
7
TSSOP
16
AD5328
12
8
±1.0
SPI
8
TSSOP
16
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