参数资料
| 型号： | AD5750-2BCPZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 25/36页 |
| 文件大小： | 0K |
| 描述： | IC CURR/VOLT OUT DRIVER 32LFCSP |
| 标准包装： | 1 |
| 放大器类型： | 仪表 |
| 电路数： | 1 |
| 转换速率： | 2 V/µs |
| 电流 - 电源： | 5.2mA |
| 电流 - 输出 / 通道： | 24mA |
| 电压 - 电源，单路/双路(±)： | ±12 V ~ 24 V |
| 工作温度： | -40°C ~ 105°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 32-LFCSP（5x5） |
| 包装： | 托盘 |
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Data Sheet
AD5750/AD5750-1/AD5750-2
Rev. E | Page 31 of 36
APPLICATIONS INFORMATION
TRANSIENT VOLTAGE PROTECTION
diodes that prevent damage from normal handling. The industrial
control environment can, however, subject I/O circuits to much
from excessively high voltage transients, external power diodes
and a surge current limiting resistor may be required, as shown
in Figure 56. The constraint on the resistor value is that during
normal operation the output level at IOUT must remain within
its voltage compliance limit of AVDD 2.75 V and the two
protection diodes and resistor must have appropriate power
ratings. Further protection can be added with transient voltage
suppressors, if needed.
Figure 56. Output Transient Voltage Protection
THERMAL CONSIDERATIONS
It is important to understand the effects of power dissipation
on the package and how it affects junction temperature. The
internal junction temperature should not exceed 125°C. The
5 mm LFCSP package. The thermal impedance, θJA, is 28°C/W. It
is important that the devices are not being operated under
conditions that cause the junction temperature to exceed its
junction temperature.
are driving the maximum current (24 mA) directly to ground.
should also be taken into account, nominally ~4 mA.
The following calculations estimate maximum power dissipation
under these worst-case conditions and determine the maximum
ambient temperature:
Power Dissipation = 26.4 V × 28 mA = 0.7392 W
Temperature Increase = 28°C × 0.7392 W = 20.7°C
Maximum Ambient Temperature = 125°C 20.7°C = 104.3°C
These figures assume that proper layout and grounding techniques
are followed to minimize power dissipation, as outlined in the
Layout Guidelines section.
LAYOUT GUIDELINES
In any circuit where accuracy is important, careful consideration
of the power supply and ground return layout helps to ensure the
AD5750-2 are mounted should be designed so that the AD5750/
AD5750-1/AD5750-2 lie on the analog plane.
bypassing of 10 μF in parallel with 0.1 μF on each supply located
as close to the package as possible, ideally right up against the
device. The 10 μF capacitors are the tantalum bead type. The
0.1 μF capacitor should have low effective series resistance
(ESR) and low effective series inductance (ESI) such as the
common ceramic types, which provide a low impedance path to
ground at high frequencies to handle transient currents due to
internal logic switching.
In systems where there are many devices on one board, it is often
useful to provide some heat sinking capability to allow the power
to dissipate easily.
beneath the device. Connect this paddle to the AVSS supply of
the part. For optimum performance, use special considerations to
design the motherboard and to mount the package. For enhanced
thermal, electrical, and board level performance, solder the
exposed paddle on the bottom of the package to the corresponding
thermal land paddle on the PCB. Design thermal vias into the
PCB land paddle area to further improve heat dissipation.
The AVSS plane on the device can be increased (as shown in
Figure 57) to provide a natural heat sinking effect.
Figure 57. Paddle Connection to Board
IOUT
AVDD
AVSS
RP
RLOAD
0
7268
-050
AD5750/
AD5750-1/
AD5750-2
AD5750/
AD5750-1/
AD5750-2
AVSS
PLANE
BOARD
0
726
8-
0
51
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相关代理商/技术参数 |
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| AD5750-2BCPZ-RL7 | 功能描述:IC CURR/VOLT OUT DRVR 32LFCSP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:73 系列:Over-The-Top® 放大器类型:通用 电路数:4 输出类型:满摆幅 转换速率:0.07 V/µs 增益带宽积:200kHz -3db带宽:- 电流 - 输入偏压:1nA 电压 - 输入偏移:285µV 电流 - 电源:50µA 电流 - 输出 / 通道:25mA 电压 - 电源，单路/双路(±):2 V ~ 44 V，±1 V ~ 22 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:16-WFDFN 裸露焊盘 供应商设备封装:16-DFN-EP（5x3） 包装:管件 |
| AD5750ACPZ | 功能描述:IC CURR/VOLT OUT DVR 32LFCSP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:1 系列:- 放大器类型:通用 电路数:4 输出类型:满摆幅 转换速率:0.028 V/µs 增益带宽积:105kHz -3db带宽:- 电流 - 输入偏压:3nA 电压 - 输入偏移:100µV 电流 - 电源:3.3µA 电流 - 输出 / 通道:12mA 电压 - 电源，单路/双路(±):2.7 V ~ 12 V，±1.35 V ~ 6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:14-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:14-TSSOP 包装:剪切带 (CT) 其它名称:OP481GRUZ-REELCT |
| AD5750ACPZ-REEL | 功能描述:IC CURR/VOLT OUT DVR 32LFCSP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:100 系列:- 放大器类型:通用 电路数:1 输出类型:- 转换速率:0.2 V/µs 增益带宽积:- -3db带宽:- 电流 - 输入偏压:100pA 电压 - 输入偏移:30µV 电流 - 电源:380µA 电流 - 输出 / 通道:- 电压 - 电源，单路/双路(±):±2 V ~ 18 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SO 包装:管件 |
| AD5750ACPZ-REEL7 | 功能描述:IC CURR/VOLT OUT DVR 32LFCSP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:100 系列:- 放大器类型:通用 电路数:1 输出类型:- 转换速率:0.2 V/µs 增益带宽积:- -3db带宽:- 电流 - 输入偏压:100pA 电压 - 输入偏移:30µV 电流 - 电源:380µA 电流 - 输出 / 通道:- 电压 - 电源，单路/双路(±):±2 V ~ 18 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SO 包装:管件 |
| AD5750BCPZ | 功能描述:IC CURR/VOLT OUT DVR 32LFCSP RoHS:是 类别:集成电路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 标准包装:150 系列:- 放大器类型:音频 电路数:2 输出类型:- 转换速率:5 V/µs 增益带宽积:12MHz -3db带宽:- 电流 - 输入偏压:100nA 电压 - 输入偏移:500µV 电流 - 电源:6mA 电流 - 输出 / 通道:50mA 电压 - 电源，单路/双路(±):4 V ~ 32 V，±2 V ~ 16 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:8-TSSOP 包装:管件 |
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