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| 型号： | AD7322BRUZ-REEL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 27/37页 |
| 文件大小： | 0K |
| 描述： | IC ADC 12BIT+SAR 2CHAN 14-TSSOP |
| 标准包装： | 2,500 |
| 位数： | 12 |
| 采样率（每秒）： | 1M |
| 数据接口： | DSP，MICROWIRE?，QSPI?，串行，SPI? |
| 转换器数目： | 1 |
| 功率耗散（最大）： | 30mW |
| 电压电源： | 双 ± |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 14-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 14-TSSOP |
| 包装： | 带卷 (TR) |
| 输入数目和类型： | 2 个单端，单极；2 个单端，双极；1 个差分，单极；1 个差分，双极 |
| 配用： | EVAL-AD7322CBZ-ND - BOARD EVALUATION FOR AD7322 |
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AD7322
Data Sheet
Rev. B | Page 32 of 36
APPLICATION HINTS
LAYOUT AND GROUNDING
The printed circuit board that houses the AD7322 should be
designed so that the analog and digital sections are confined to
certain areas of the board. This design facilitates the use of
ground planes that can easily be separated.
To provide optimum shielding for ground planes, a minimum
etch technique is generally best. All AGND pins on the AD7322
should be connected to the AGND plane. Digital and analog
ground pins should be joined in only one place. If the AD7322
is in a system where multiple devices require an AGND and
DGND connection, the connection should still be made at only
one point. A star point should be established as close as possible
to the ground pins on the AD7322.
Good connections should be made to the power and ground
planes. This can be done with a single via or multiple vias for
each supply and ground pin.
Avoid running digital lines under the AD7322 device because
this couples noise onto the die. However, the analog ground
plane should be allowed to run under the AD7322 to avoid
noise coupling. The power supply lines to the AD7322 device
should use as large a trace as possible to provide low impedance
paths and reduce the effects of glitches on the power supply line.
To avoid radiating noise to other sections of the board, com-
ponents with fast switching signals, such as clocks, should be
shielded with digital ground and never run near the analog inputs.
Avoid crossover of digital and analog signals. To reduce the effects
of feedthrough within the board, traces should be run at right
angles to each other. A microstrip technique is the best method,
but its use may not be possible with a double-sided board. In this
technique, the component side of the board is dedicated to ground
planes, and signals are placed on the other side.
Good decoupling is also important. All analog supplies should
be decoupled with 10 F tantalum capacitors in parallel with
0.1 F capacitors to AGND. To achieve the best results from
these decoupling components, they must be placed as close as
possible to the device, ideally right up against the device. The
0.1 F capacitors should have a low effective series resistance
(ESR) and low effective series inductance (ESI), such as is
typical of common ceramic and surface-mount types of
capacitors. These low ESR, low ESI capacitors provide a low
impedance path to ground at high frequencies to handle
transient currents due to internal logic switching.
POWER SUPPLY CONFIGURATION
It is recommended that Schottky diodes be placed in series with
Schottky diode configuration. BAT43 Schottky diodes are used.
04863-
056
VIN0
VIN1
CS
SCLK
DOUT
DIN
VDD
VCC
VSS
AD73221
V–
V+
3V/5V
1ADDITIONAL PINS OMITTED FOR CLARITY.
Figure 53. Schottky Diode Connection
In an application where nonsymmetrical VDD and VSS supplies
are being used, adhere to the following guidelines. Table 16
outlines the VSS supply range that can be used for particular VDD
voltages when nonsymmetrical supplies are required. When
recommended that these supplies be symmetrical.
For the 0 V to 4 × VREF range, VSS can be tied to AGND as per
minimum supply recommendations outlined in Table 6.
Table 16. Nonsymmetrical VDD and VSS Requirements
VDD
Typical VSS Range
5 V
5 V to 5.5 V
6 V
5 V to 8.5 V
7 V
5 V to 11.5 V
8 V
5 V to 15 V
9 V
5 V to 16.5 V
10 V to 16.5 V
5 V to 16.5 V
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