REV. 0
AD73322L
–7–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD73322L features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
*
(T
A
= 25
°
C unless otherwise noted)
AVDD, DVDD to GND . . . . . . . . . . . . . . .
–
0.3 V to +4.6 V
AGND to DGND . . . . . . . . . . . . . . . . . . . .
–
0.3 V to +0.3 V
Digital I/O Voltage to DGND . . .
–
0.3 V to (DVDD + 0.3 V)
Analog I/O Voltage to AGND . . .
–
0.3 V to (AVDD + 0.3 V)
Operating Temperature Range
Industrial (A Version) . . . . . . . . . . . . . . .
–
40
°
C to +85
°
C
Extended (Y Version) . . . . . . . . . . . . . . . .
–
40
°
C to +105
°
C
Storage Temperature Range . . . . . . . . . . . .
–
65
°
C to +150
°
C
Maximum Junction Temperature . . . . . . . . . . . . . . . . 150
°
C
SOIC,
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . 71.4
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
LQFP,
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . 53.2
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
ORDERING GUIDE
Temperature
Range
Package
Descriptions
Package
Option
Model
AD73322LAR
AD73322LARU
AD73322LAST
–
40
°
C to +85
°
C
–
40
°
C to +85
°
C
–
40
°
C to +85
°
C
Wide Body SOIC
Thin Shrink TSSOP
Plastic Thin Quad
Flatpack (LQFP)
Wide Body SOIC
Thin Shrink TSSOP
Plastic Thin Quad
Flatpack (LQFP)
Evaluation Board
R-28
RU-28
ST-44A
AD73322LYR
AD73322LYRU
AD73322LYST
–
40
°
C to +105
°
C
–
40
°
C to +105
°
C
–
40
°
C to +105
°
C
R-28
RU-28
ST-44A
EVAL-AD73322LEB
PIN CONFIGURATIONS
28-Lead Wide Body SOIC
(R-28)
TOP VIEW
(Not to Scale)
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
AD73322L
SDO
MCLK
SCLK
RESET
DVDD
DGND
AGND2
VINP1
VFBP1
VINN1
VFBN1
AVDD2
REFCAP
REFOUT
SDOFS
SDIFS
SDI
SE
AGND1
AVDD1
VOUTP2
VFBN2
VINN2
VFBP2
VINP2
VOUTN2
VOUTP1
VOUTN1
44-Lead Plastic Thin Quad Flatpack (LQFP)
(ST-44A)
3
4
5
6
7
1
2
10
11
8
9
40 39
38
41
42
43
44
36 35 34
37
29
30
31
32
33
27
28
25
26
23
24
PIN 1
TOP VIEW
(Not to Scale)
AD73322L
12 13 14 15 16 17 18 19 20 21 22
N
R
NC
VOUTN1
VOUTP1
NC
VOUTN2
VOUTP2
NC
REFOUT
REFCAP
AVDD2
AVDD2
AGND2
AGND2
AGND2
NC = NO CONNECT
AGND2
DGND
DGND
DVDD
AVDD1
S
N
AVDD1
S
AGND1
AGND1
N
V
V
V
V
V
N
V
S
M
S
V
N
S
V
S
N
28-Lead Thin Shrink TSSOP
(RU-28)
TOP VIEW
(Not to Scale)
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
AD73322L
SDO
MCLK
SCLK
RESET
DVDD
DGND
AGND2
VINP1
VFBP1
VINN1
VFBN1
AVDD2
REFCAP
REFOUT
SDOFS
SDIFS
SDI
SE
AGND1
AVDD1
VOUTP2
VFBN2
VINN2
VFBP2
VINP2
VOUTN2
VOUTP1
VOUTN1
TSSOP,
θ
JA
Thermal Impedance . . . . . . . . . . . . . . 97.9
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
*
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.