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参数资料
型号： AD73322LAR
厂商： ANALOG DEVICES INC
元件分类： 通信及网络
英文描述： Low Cost, Low Power CMOS General-Purpose Dual Analog Front End
中文描述： SPECIALTY TELECOM CIRCUIT, PDSO28
封装： MS-013AE, SOIC-28
文件页数： 7/40页
文件大小： 437K
代理商： AD73322LAR
REV. 0
AD73322L
–7–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD73322L features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
*
(T
A
= 25
°
C unless otherwise noted)
AVDD, DVDD to GND . . . . . . . . . . . . . . .
–
0.3 V to +4.6 V
AGND to DGND . . . . . . . . . . . . . . . . . . . .
–
0.3 V to +0.3 V
Digital I/O Voltage to DGND . . .
–
0.3 V to (DVDD + 0.3 V)
Analog I/O Voltage to AGND . . .
–
0.3 V to (AVDD + 0.3 V)
Operating Temperature Range
Industrial (A Version) . . . . . . . . . . . . . . .
–
40
°
C to +85
°
C
Extended (Y Version) . . . . . . . . . . . . . . . .
–
40
°
C to +105
°
C
Storage Temperature Range . . . . . . . . . . . .
–
65
°
C to +150
°
C
Maximum Junction Temperature . . . . . . . . . . . . . . . . 150
°
C
SOIC,
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . 71.4
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
LQFP,
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . 53.2
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
ORDERING GUIDE
Temperature
Range
Package
Descriptions
Package
Option
Model
AD73322LAR
AD73322LARU
AD73322LAST
–
40
°
C to +85
°
C
–
40
°
C to +85
°
C
–
40
°
C to +85
°
C
Wide Body SOIC
Thin Shrink TSSOP
Plastic Thin Quad
Flatpack (LQFP)
Wide Body SOIC
Thin Shrink TSSOP
Plastic Thin Quad
Flatpack (LQFP)
Evaluation Board
R-28
RU-28
ST-44A
AD73322LYR
AD73322LYRU
AD73322LYST
–
40
°
C to +105
°
C
–
40
°
C to +105
°
C
–
40
°
C to +105
°
C
R-28
RU-28
ST-44A
EVAL-AD73322LEB
PIN CONFIGURATIONS
28-Lead Wide Body SOIC
(R-28)
TOP VIEW
(Not to Scale)
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
AD73322L
SDO
MCLK
SCLK
RESET
DVDD
DGND
AGND2
VINP1
VFBP1
VINN1
VFBN1
AVDD2
REFCAP
REFOUT
SDOFS
SDIFS
SDI
SE
AGND1
AVDD1
VOUTP2
VFBN2
VINN2
VFBP2
VINP2
VOUTN2
VOUTP1
VOUTN1
44-Lead Plastic Thin Quad Flatpack (LQFP)
(ST-44A)
3
4
5
6
7
1
2
10
11
8
9
40 39
38
41
42
43
44
36 35 34
37
29
30
31
32
33
27
28
25
26
23
24
PIN 1
TOP VIEW
(Not to Scale)
AD73322L
12 13 14 15 16 17 18 19 20 21 22
N
R
NC
VOUTN1
VOUTP1
NC
VOUTN2
VOUTP2
NC
REFOUT
REFCAP
AVDD2
AVDD2
AGND2
AGND2
AGND2
NC = NO CONNECT
AGND2
DGND
DGND
DVDD
AVDD1
S
N
AVDD1
S
AGND1
AGND1
N
V
V
V
V
V
N
V
S
M
S
V
N
S
V
S
N
28-Lead Thin Shrink TSSOP
(RU-28)
TOP VIEW
(Not to Scale)
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
AD73322L
SDO
MCLK
SCLK
RESET
DVDD
DGND
AGND2
VINP1
VFBP1
VINN1
VFBN1
AVDD2
REFCAP
REFOUT
SDOFS
SDIFS
SDI
SE
AGND1
AVDD1
VOUTP2
VFBN2
VINN2
VFBP2
VINP2
VOUTN2
VOUTP1
VOUTN1
TSSOP,
θ
JA
Thermal Impedance . . . . . . . . . . . . . . 97.9
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
*
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
相关PDF资料
PDF描述
AD73322LAST Low Cost, Low Power CMOS General-Purpose Dual Analog Front End
AD73322EB Low Power 10MHz Current Feedback Amplifier; Package: SO; No of Pins: 8; Temperature Range: 0°C to +70°C
AD73322EZ Precision Rail-to-Rail Input and Output Op Amp; Package: SO; No of Pins: 8; Temperature Range: 0°C to +70°C
AD73322LYR Low Cost, Low Power CMOS General-Purpose Dual Analog Front End
AD73322LYRU Low Cost, Low Power CMOS General-Purpose Dual Analog Front End
相关代理商/技术参数
参数描述
AD73322LAR-REEL 制造商:Analog Devices 功能描述:Audio Codec 2ADC / 2DAC 16-Bit 28-Pin SOIC W T/R 制造商:Rochester Electronics LLC 功能描述:SPEECH AND TELEPHONY CODEC I.C. - Tape and Reel
AD73322LARU 制造商:Analog Devices 功能描述:Audio Codec 2ADC / 2DAC 16-Bit 28-Pin TSSOP 制造商:Rochester Electronics LLC 功能描述:SPEECH AND TELEPHONY CODEC I.C. - Bulk 制造商:Analog Devices 功能描述:IC AUDIO CODEC
AD73322LARU-REEL 制造商:Analog Devices 功能描述:Audio Codec 2ADC / 2DAC 16-Bit 28-Pin TSSOP T/R 制造商:Rochester Electronics LLC 功能描述:SPEECH AND TELEPHONY CODEC I.C. - Tape and Reel
AD73322LARUZ 功能描述:IC PROCESSOR FRONTEND DL 28TSSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模拟前端 (AFE) 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 位数:- 通道数:2 功率（瓦特）:- 电压 - 电源，模拟:3 V ~ 3.6 V 电压 - 电源，数字:3 V ~ 3.6 V 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:带卷 (TR)
AD73322LARUZ-REEL 功能描述:IC PROCESSOR FRONTEND DL 28TSSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模拟前端 (AFE) 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 位数:- 通道数:2 功率（瓦特）:- 电压 - 电源，模拟:3 V ~ 3.6 V 电压 - 电源，数字:3 V ~ 3.6 V 封装/外壳:32-VFQFN 裸露焊盘 供应商设备封装:32-QFN（5x5） 包装:带卷 (TR)
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