收藏本站
参数资料
型号： AD73322LYST
厂商： ANALOG DEVICES INC
元件分类： 通信及网络
英文描述： Low Cost, Low Power CMOS General-Purpose Dual Analog Front End
中文描述： SPECIALTY TELECOM CIRCUIT, PQFP44
封装： PLASTIC, MS-026-BEA, LQFP-44
文件页数： 7/40页
文件大小： 437K
代理商： AD73322LYST
REV. 0
AD73322L
–7–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD73322L features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
*
(T
A
= 25
°
C unless otherwise noted)
AVDD, DVDD to GND . . . . . . . . . . . . . . .
–
0.3 V to +4.6 V
AGND to DGND . . . . . . . . . . . . . . . . . . . .
–
0.3 V to +0.3 V
Digital I/O Voltage to DGND . . .
–
0.3 V to (DVDD + 0.3 V)
Analog I/O Voltage to AGND . . .
–
0.3 V to (AVDD + 0.3 V)
Operating Temperature Range
Industrial (A Version) . . . . . . . . . . . . . . .
–
40
°
C to +85
°
C
Extended (Y Version) . . . . . . . . . . . . . . . .
–
40
°
C to +105
°
C
Storage Temperature Range . . . . . . . . . . . .
–
65
°
C to +150
°
C
Maximum Junction Temperature . . . . . . . . . . . . . . . . 150
°
C
SOIC,
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . 71.4
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
LQFP,
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . 53.2
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
ORDERING GUIDE
Temperature
Range
Package
Descriptions
Package
Option
Model
AD73322LAR
AD73322LARU
AD73322LAST
–
40
°
C to +85
°
C
–
40
°
C to +85
°
C
–
40
°
C to +85
°
C
Wide Body SOIC
Thin Shrink TSSOP
Plastic Thin Quad
Flatpack (LQFP)
Wide Body SOIC
Thin Shrink TSSOP
Plastic Thin Quad
Flatpack (LQFP)
Evaluation Board
R-28
RU-28
ST-44A
AD73322LYR
AD73322LYRU
AD73322LYST
–
40
°
C to +105
°
C
–
40
°
C to +105
°
C
–
40
°
C to +105
°
C
R-28
RU-28
ST-44A
EVAL-AD73322LEB
PIN CONFIGURATIONS
28-Lead Wide Body SOIC
(R-28)
TOP VIEW
(Not to Scale)
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
AD73322L
SDO
MCLK
SCLK
RESET
DVDD
DGND
AGND2
VINP1
VFBP1
VINN1
VFBN1
AVDD2
REFCAP
REFOUT
SDOFS
SDIFS
SDI
SE
AGND1
AVDD1
VOUTP2
VFBN2
VINN2
VFBP2
VINP2
VOUTN2
VOUTP1
VOUTN1
44-Lead Plastic Thin Quad Flatpack (LQFP)
(ST-44A)
3
4
5
6
7
1
2
10
11
8
9
40 39
38
41
42
43
44
36 35 34
37
29
30
31
32
33
27
28
25
26
23
24
PIN 1
TOP VIEW
(Not to Scale)
AD73322L
12 13 14 15 16 17 18 19 20 21 22
N
R
NC
VOUTN1
VOUTP1
NC
VOUTN2
VOUTP2
NC
REFOUT
REFCAP
AVDD2
AVDD2
AGND2
AGND2
AGND2
NC = NO CONNECT
AGND2
DGND
DGND
DVDD
AVDD1
S
N
AVDD1
S
AGND1
AGND1
N
V
V
V
V
V
N
V
S
M
S
V
N
S
V
S
N
28-Lead Thin Shrink TSSOP
(RU-28)
TOP VIEW
(Not to Scale)
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
AD73322L
SDO
MCLK
SCLK
RESET
DVDD
DGND
AGND2
VINP1
VFBP1
VINN1
VFBN1
AVDD2
REFCAP
REFOUT
SDOFS
SDIFS
SDI
SE
AGND1
AVDD1
VOUTP2
VFBN2
VINN2
VFBP2
VINP2
VOUTN2
VOUTP1
VOUTN1
TSSOP,
θ
JA
Thermal Impedance . . . . . . . . . . . . . . 97.9
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
*
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
相关PDF资料
PDF描述
AD73322L KNOB, RT25; Series:29JF RoHS Compliant: Yes
AD73322 Low Cost, Low Power CMOS General Purpose Dual Analog Front End(低成本，低功耗的CMOS通用双模拟前端处理器)
AD73411 Low-Power CMOS Analog Front End with DSP Microcomputer(带DSP微计算机的单模拟前端)
AD73422-40K Integrated Dual Analog Front End Codec And DSP Microcomputer(集成双模拟前端的信号编解码器和数字信号处理器的芯片)
AD73422BB-80 Dual Low Power CMOS Analog Front End with DSP Microcomputer
相关代理商/技术参数
参数描述
AD73322LYSTZ 制造商:Rochester Electronics LLC 功能描述: 制造商:Analog Devices 功能描述:
AD73360 制造商:AD 制造商全称:Analog Devices 功能描述:Six-Input Channel Analog Front End
AD73360AR 制造商:Analog Devices 功能描述:AFE General Purpose 6ADC 16-Bit 5V 28-Pin SOIC W 制造商:Analog Devices 功能描述:IC 16-BIT ADC
AD73360AR-REEL 制造商:Analog Devices 功能描述:AFE General Purpose 6ADC 16-Bit 5V 28-Pin SOIC W T/R 制造商:Analog Devices 功能描述:AFE GEN PURPOSE 6ADC 16BIT 5V/5V/5V 28SOIC W - Tape and Reel
AD73360AR-REEL7 制造商:Analog Devices 功能描述:AFE General Purpose 6ADC 16-Bit 5V 28-Pin SOIC W T/R 制造商:Analog Devices 功能描述:AFE GEN PURPOSE 6ADC 16BIT 5V/5V/5V 28SOIC W - Tape and Reel
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*