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参数资料
| 型号： | AD7478AARMZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 19/29页 |
| 文件大小： | 0K |
| 描述： | IC ADC 8BIT 1MSPS 8-MSOP |
| 标准包装： | 50 |
| 位数： | 8 |
| 采样率（每秒）： | 1M |
| 数据接口： | DSP，MICROWIRE?，QSPI?，串行，SPI? |
| 转换器数目： | 1 |
| 功率耗散（最大）： | 17.5mW |
| 电压电源： | 单电源 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-TSSOP，8-MSOP（0.118"，3.00mm 宽） |
| 供应商设备封装： | 8-MSOP |
| 包装： | 管件 |
| 输入数目和类型： | 1 个单端，单极 |
| 产品目录页面： | 778 (CN2011-ZH PDF) |
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AD7476A/AD7477A/AD7478A
Rev. F | Page 25 of 28
APPLICATION HINTS
GROUNDING AND LAYOUT
Design the printed circuit board that houses the AD7476A/
AD7477A/AD7478A such that the analog and digital sections
are separated and confined to certain areas of the board. This
facilitates the use of ground planes that can be separated easily.
A minimum etch technique is generally best for ground planes
because it gives the best shielding. Join digital and analog
ground planes at only one place. If the AD7476A/AD7477A/
AD7478A is in a system where multiple devices require an
AGND to DGND connection, make the connection at one
point only, a star ground point that is established as close as
possible to the AD7476A/AD7477A/AD7478A.
Avoid running digital lines under the device as these couple
noise onto the die. Allow the analog ground plane to run under
the AD7476A/AD7477A/AD7478A in order to avoid noise
coupling. Use as large a trace as possible on the power supply
lines to the AD7476A/AD7477A/AD7478A to provide low
impedance paths and reduce the effects of glitches on the power
supply line. Shield fast switching signals like clocks with digital
grounds to avoid radiating noise to other sections of the board,
and never run clock signals near the analog inputs. Avoid crossover
of digital and analog signals. Run traces on opposite sides of the
board at right angles to each other. This reduces the effects of
feedthrough through the board. A microstrip technique is by far
the best but is not always possible with a double-sided board. In
this technique, the component side of the board is dedicated to
ground planes while signals are placed on the solder side.
Good decoupling is also very important. Decouple the supply
with, for instance, a 680 nF 0805 capacitor to GND. When using
the SC70 package in applications where the size of the components
is of concern, a 220 nF 0603 capacitor, for example, can be used
instead. However, in that case, the decoupling may not be as
effective, resulting in an approximate SINAD degradation of
0.3 dB. To achieve the best performance from these decoupling
components, the user should endeavor to keep the distance
between the decoupling capacitor and the VDD and GND pins to
a minimum with short track lengths connecting the respective
pins. Figure 31 and Figure 32 and show the recommended
positions of the decoupling capacitor for the SC70 and MSOP
packages, respectively.
02930-032
Figure 31. Recommended Supply Decoupling Scheme for the SC70 Package
As can be seen in Figure 32, for the MSOP package, the
decoupling capacitor has been placed as close as possible to the
IC with short track lengths to VDD and GND pins. The
decoupling capacitor can also be placed on the underside of the
PCB directly underneath the IC, between the VDD and GND
pins attached by vias. This method is not recommended on
PCBs above a standard 1.6 mm thickness. The best performance
is realized with the decoupling capacitor on the top of the PCB
next to the IC.
Similarly, for the SC70 package, locate the decoupling capacitor
as close as possible to the VDD and the GND pins. Because of its
pinout, that is, VDD being next to GND, the decoupling capacitor
can be placed extremely close to the IC. The decoupling capacitor
can be placed on the underside of the PCB directly under the
VDD and GND pins, but the best performance is achieved with
the decoupling capacitor on the same side as the IC.
02930-031
Figure 32. Recommended Supply Decoupling Scheme for the
AD7476A/AD7477A/AD7478A MSOP Package
EVALUATING THE AD7476A/AD7477A
PERFORMANCE
The evaluation board package includes a fully assembled and
tested evaluation board, documentation, and software for
controlling the board from the PC via the EVAL-BOARD
CONTROLLER. The EVAL-BOARD CONTROLLER can be
used in conjunction with the AD7476ACB/AD7477ACB
evaluation board, as well as many other Analog Devices
evaluation boards ending in the CB designator, to
demonstrate/evaluate the ac and dc performance of the
AD7476A/AD7477A. The software allows the user to perform
ac (fast Fourier transform) and dc (histogram of codes) tests on
the AD7476A/AD7477A. See the evaluation board application
note for more information.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AD7478AARMZ-REEL | 功能描述:IC ADC 8BIT 1MSPS 8-MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:2,500 系列:- 位数:16 采样率（每秒）:15 数据接口:MICROWIRE?，串行，SPI? 转换器数目:1 功率耗散（最大）:480µW 电压电源:单电源 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:38-WFQFN 裸露焊盘 供应商设备封装:38-QFN（5x7） 包装:带卷 (TR) 输入数目和类型:16 个单端，双极；8 个差分，双极 配用:DC1011A-C-ND - BOARD DELTA SIGMA ADC LTC2494 |
| AD7478AARMZ-REEL7 | 功能描述:IC ADC 8BIT 1MSPS 8-MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:2,500 系列:- 位数:16 采样率（每秒）:15 数据接口:MICROWIRE?，串行，SPI? 转换器数目:1 功率耗散（最大）:480µW 电压电源:单电源 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:38-WFQFN 裸露焊盘 供应商设备封装:38-QFN（5x7） 包装:带卷 (TR) 输入数目和类型:16 个单端，双极；8 个差分，双极 配用:DC1011A-C-ND - BOARD DELTA SIGMA ADC LTC2494 |
| AD7478ART | 制造商:Analog Devices 功能描述:ADC SGL SAR 1MSPS 8BIT SERL 6PIN SOT-23 - Bulk |
| AD7478ART-500RL7 | 功能描述:IC ADC 8BIT 1MSPS SOT-23-6 RoHS:否 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 位数:12 采样率（每秒）:3M 数据接口:- 转换器数目:- 功率耗散（最大）:- 电压电源:- 工作温度:- 安装类型:表面贴装 封装/外壳:SOT-23-6 供应商设备封装:SOT-23-6 包装:带卷 (TR) 输入数目和类型:- |
| AD7478ART-REEL | 制造商:AD 制造商全称:Analog Devices 功能描述:1 MSPS, 12-/10-/8-Bit ADCs in 6-Lead SOT-23 |
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