参数资料
型号: AD7606BSTZ-4
厂商: Analog Devices Inc
文件页数: 27/36页
文件大小: 0K
描述: IC DAS W/ADC 16BIT 4CH 64LQFP
设计资源: Layout Considerations for an Expandable Multichannel Simultaneous Sampling Data Acquisition System Based on AD7606 (CN0148)
标准包装: 1
类型: 数据采集系统(DAS),ADC
分辨率(位): 16 b
采样率(每秒): 200k
数据接口: DSP,MICROWIRE?,并联,QSPI?,串行,SPI?
电压电源: 模拟和数字
电源电压: 2.3 V ~ 5.25 V,4.75 V ~ 5.25 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 64-LQFP
供应商设备封装: 64-LQFP(10x10)
包装: 托盘
Data Sheet
AD7606/AD7606-6/AD7606-4
Rev. C | Page 33 of 36
To ensure good device-to-device performance matching in
a system that contains multiple AD7606/AD7606-6/AD7606-4
devices, a symmetrical layout between the AD7606/AD7606-6/
AD7606-4 devices is important.
Figure 64 shows a layout with two AD7606/AD7606-6/AD7606-4
devices. The AVCC supply plane runs to the right of both devices,
and the VDRIVE supply track runs to the left of the two devices.
The reference chip is positioned between the two devices, and
the reference voltage track runs north to Pin 42 of U1 and south
to Pin 42 of U2. A solid ground plane is used.
These symmetrical layout principles can also be applied to a system
that contains more than two AD7606/AD7606-6/AD7606-4
devices. The AD7606/AD7606-6/AD7606-4 devices can be placed
in a north-south direction, with the reference voltage located
midway between the devices and the reference track running in
the north-south direction, similar to Figure 64.
AVCC
U2
U1
AVCC
U2
U1
08479-
056
Figure 64. Layout for Multiple AD7606 Devices—Top Layer and
Supply Plane Layer
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相关代理商/技术参数
参数描述
AD7606BSTZ-4 制造商:Analog Devices 功能描述:IC, ADC, 16BIT, 200KSPS, QFP-64
AD7606BSTZ-4RL 功能描述:IC DAS W/ADC 16BIT 64LQFP RoHS:是 类别:集成电路 (IC) >> 数据采集 - ADCs/DAC - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 类型:数据采集系统(DAS) 分辨率(位):16 b 采样率(每秒):21.94k 数据接口:MICROWIRE?,QSPI?,串行,SPI? 电压电源:模拟和数字 电源电压:1.8 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP(6x6) 包装:托盘
AD7606BSTZ-6 功能描述:IC DAS W/ADC 16BIT 6CH 64LQFP RoHS:是 类别:集成电路 (IC) >> 数据采集 - ADCs/DAC - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 类型:数据采集系统(DAS) 分辨率(位):16 b 采样率(每秒):21.94k 数据接口:MICROWIRE?,QSPI?,串行,SPI? 电压电源:模拟和数字 电源电压:1.8 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP(6x6) 包装:托盘
AD7606BSTZ-6RL 功能描述:IC DAS W/ADC 16BIT 64LQFP RoHS:是 类别:集成电路 (IC) >> 数据采集 - ADCs/DAC - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 类型:数据采集系统(DAS) 分辨率(位):16 b 采样率(每秒):21.94k 数据接口:MICROWIRE?,QSPI?,串行,SPI? 电压电源:模拟和数字 电源电压:1.8 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP(6x6) 包装:托盘
AD7606BSTZ-RL 功能描述:IC DAS W/ADC 16BIT 64LQFP RoHS:是 类别:集成电路 (IC) >> 数据采集 - ADCs/DAC - 专用型 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 类型:数据采集系统(DAS) 分辨率(位):16 b 采样率(每秒):21.94k 数据接口:MICROWIRE?,QSPI?,串行,SPI? 电压电源:模拟和数字 电源电压:1.8 V ~ 3.6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:40-WFQFN 裸露焊盘 供应商设备封装:40-TQFN-EP(6x6) 包装:托盘